Die Thickness Minimum :50um (Thinner Pending Discuss ) Ultra Thin Die Sorter MDND-120UT Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ...
Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine
Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching
Eutectic refers to the phenomenon of eutectic fusion in eutectic solder at relatively low temperatures. Eutectic alloys directly change from solid to liquid without going through the plastic stage, and their thermal conductivity, resistance, shear fo...
IC design, also known as integrated circuit design, has high precision in nano process technology, and the higher the accuracy, the more advanced the production process. When more transistors are integrated into the processor, the chip can achieve mo...
Low dimensional material etching refers to the process of etching two-dimensional materials (such as graphene, molybdenum disulfide, etc.) and one-dimensional materials (such as nanowires, nanotubes, etc.). The purpose of low dimensional material etc...
Vacuum Plasma and Microwave Plasma Application: Semiconductor industry Car industry Mobile industry Camera module PCB industry LED industry FPC industry Material industry Metal industry Ceramics industry
Semiconductor TEC TEC Thermoelectric Cooler / Thermo Electric Cooler Die bonding machine
A customer from Brazil who makes display screen casings discovered during R&D that their products were peeling off after glue was dispensed. After communicating with MH engineers, we customized this equipment solution for them: direct injection p...
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