Die Thickness Minimum :50um (Thinner Pending Discuss )
Ultra Thin Die Sorter MDND-120UT
|
Project |
Parameters |
|
Equipment Name |
MDND-120UT multi-function die bonder |
|
Equipment Model |
MDND-120UT |
|
Bonding Accuracy/Angle |
±20um, ±0.5 (calibration film) |
|
Bond Force |
50~2000gf |
|
CPH |
1000 (50ms process time, final efficiency depends on process and process time) |
|
Chip Size |
0.5~15mm |
|
Dustproof Level |
Class 1000 |
|
Compatible Substrate/Tray |
MAX: 300*200mm |
|
Compatible Auxiliary Material Fixture |
Expander Rings: 4"/6" * 3pcs, 8"*1pcs |
|
Equipment Size |
Wafer Ring: 4"/6"/8"/12" * 1pcs |
|
Weight |
1610 x 1420 x 1700mm |
Product Introduction:
Technology Core：
This solution is applicable to chip sizes:
0,65х0,65
4,6х4,6
2,7х1,6
2,0х1,6
1,55х1,15
2,3х1,75
1,6х1,4
This solution is applicable to chips:
＞50um chips
Size: ≥6mm
Guangzhou Minder-Hightech Co.,Ltd.
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