Optoelectronic Devices, Uncooled Infrared Detectors, and Short-Wave Infrared Detectors factory equipments
Ceramic non-refrigerated Detector Packaging Product introduction: The product uses Vanadium Oxide (VOx) uncooled sensors, with pixel sizes of 17μm12um and resolutions of384x288 /640x512.The product features low power consumption, compact size, an...
Wafer Stripper/ Wafer Stripping System /Photoresist Stripper / Wafer Photoresist Stripper /Wafer Ashing System /Wafer Ashing Equipment
Fully automatic parallel sealing welding machine customized by the customer, featuring four glove workstations
Semi-Automatic Welding Machine for Automotive Sensors Technical Solution
Customized assembly-line plasma treatment system for object surfaces
This device is highly suitable for use in university chip laboratories. We provide you with one-stop professional solution for semiconductor fabrication and various chips package equipments sulotion from China. The process engineer and electrical engineer from the user side have completed the acceptance inspection of the Mask Aligner -MDXN-G33D8 equipment.
Advanced Wedge Bonder Comparation Table Spe Minder-Hightech MDZW-WB1875 A certain American brand Wire Bonder Technical Specifications (Detailed) mode of operation Manual Operation Semi-automatic: Manual positioning and a...
Transistor Outline (TO) is a type of transistor package designed to allow for the formation of leads and surface mounting. As a packaged device, the ingress of dust or moisture under unsealed conditions can impair product performance, directly alter...
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