This is the battery pack assembly line equipment we customized for our customers in 2022. This production line includes four types of equipment: Glue fixation machine, UV Curing machine, Laser cleaning machine, Wire bonding machine. We used th...
Before Spring Festival in 2021, a British customer found Minder-Hightech to purchase Plasma Cleaning Equipment to improve their product production technology. Customer products need to be applied and stickers after surface treatment, and the size is...
In September 2021, a capacitor manufacturer from the Czech Republic approached us and requested the addition of a new capacitor production equipment, a metal film capacitor winding machine, due to the increase in product output and improvement req...
Technical features: 1. Visual assisted positioning The TO Fully Automatic Visual Sealing Machine is equipped with an advanced visual system, which can identify the welding target in real time and perform precise positioning to ensure the coaxiality o...
Die Thickness Minimum :50um (Thinner Pending Discuss ) Ultra Thin Die Sorter MDND-120UT Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ...
Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine
Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching
Eutectic refers to the phenomenon of eutectic fusion in eutectic solder at relatively low temperatures. Eutectic alloys directly change from solid to liquid without going through the plastic stage, and their thermal conductivity, resistance, shear fo...
IC design, also known as integrated circuit design, has high precision in nano process technology, and the higher the accuracy, the more advanced the production process. When more transistors are integrated into the processor, the chip can achieve mo...
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