Guangzhou Minder-Hightech Co.,Ltd.

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Battery Pack Wire Bonding Line
01 Jul 2024

Battery Pack Wire Bonding Line

This is the battery pack assembly line equipment we customized for our customers in 2022. This production line includes four types of equipment: Glue fixation machine, UV Curing machine,  Laser cleaning machine, Wire bonding machine. We used th...

Professional Improvement of Special Products for Customers  Customized Assembly Line Atmospheric Plasma Cleaning Machine
21 May 2024

Professional Improvement of Special Products for Customers Customized Assembly Line Atmospheric Plasma Cleaning Machine

Before Spring Festival in 2021, a British customer found Minder-Hightech to purchase Plasma Cleaning Equipment to improve their product production technology. Customer products need to be applied and stickers after surface treatment, and the size is...

China Europe Tour of Capacitor Winder - Czech Republic
18 Apr 2024

China Europe Tour of Capacitor Winder - Czech Republic

In September 2021, a capacitor manufacturer from the Czech Republic approached us and requested the addition of a new capacitor production equipment, a metal film capacitor winding machine, due to the increase in product output and improvement req...

TO Fully Automatic Visual Seal Welding Machine: Creating Efficient and Intelligent Welding Solutions
21 Jul 2025

TO Fully Automatic Visual Seal Welding Machine: Creating Efficient and Intelligent Welding Solutions

Technical features: 1. Visual assisted positioning The TO Fully Automatic Visual Sealing Machine is equipped with an advanced visual system, which can identify the welding target in real time and perform precise positioning to ensure the coaxiality o...

Ultra Thin Die Sorter:Die Thickness Minimum :50um (Thinner Pending Discuss )
17 Jul 2025

Ultra Thin Die Sorter:Die Thickness Minimum :50um (Thinner Pending Discuss )

Die Thickness Minimum :50um (Thinner Pending Discuss ) Ultra Thin Die Sorter MDND-120UT Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ...

Basic Theory of  Fully Automatic Semiconductor Wire Ball Bonding Machine
06 Jun 2025

Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine

Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine

Etching: One of the 3 core Equipment in Semiconductor Manufacturing
28 May 2025

Etching: One of the 3 core Equipment in Semiconductor Manufacturing

Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching

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