Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine

Time : 2025-06-06

Speed: 21w/s for 2mm

Wire area: 56 x 80mm

Lead frame width: 28~90mm

Basic theory of Wire Bonding (W/B):

1. Principle of welding: The high-frequency vibration of ultrasound is transmitted to the surfaces of two objects to be welded. Under the cooperation of other factors such as pressure, the surfaces of the two objects are rubbed against each other to form a fusion between the molecular layers.

2. Four basic elements of welding (BONDING):

How to get the best welding, the main factors are as follows:

BOND FORCE

BOND POWER

BOND TIME

TEMPERATURE

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