This device is highly suitable for use in university chip laboratories. We provide you with one-stop professional solution for semiconductor fabrication and various chips package equipments sulotion from China. The process engineer and electrical engineer from the user side have completed the acceptance inspection of the Mask Aligner -MDXN-G33D8 equipment.
Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching
Low dimensional material etching refers to the process of etching two-dimensional materials (such as graphene, molybdenum disulfide, etc.) and one-dimensional materials (such as nanowires, nanotubes, etc.). The purpose of low dimensional material etc...
The rapid annealing furnace uses halogen infrared lamp as the heat source to heat the material to the required temperature through rapid heating, so as to improve the crystal structure and optoelectronic properties of the material. Its features inc...
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