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Basic Theory of  Fully Automatic Semiconductor Wire Ball Bonding Machine
06 Jun 2025

Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine

Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine

Gold tin Eutectic Soldering Technology for GaAs Power Chips
16 May 2025

Gold tin Eutectic Soldering Technology for GaAs Power Chips

Eutectic refers to the phenomenon of eutectic fusion in eutectic solder at relatively low temperatures. Eutectic alloys directly change from solid to liquid without going through the plastic stage, and their thermal conductivity, resistance, shear fo...

Small Manual Chip Packaging Equipment for Laboratories: Plasma Surface Treatment, Oven, Die bonding machine, Wire bonder
28 Oct 2024

Small Manual Chip Packaging Equipment for Laboratories: Plasma Surface Treatment, Oven, Die bonding machine, Wire bonder

Minder-Hightech is an integrated supplier of equipment for entire semiconductor packaging industry. The demand proposed by the European client this time is to customize small manual equipment for chip packaging for laboratory teaching. After multipl...

Small manual IC packaging equipment used in the laboratory: Plasma surface machine, Oven, Die bonder, Wire bonder.
25 Oct 2024

Small manual IC packaging equipment used in the laboratory: Plasma surface machine, Oven, Die bonder, Wire bonder.

Minder-Hightech is an integrated supplier of equipment for entire semiconductor packaging industry. The demand proposed by the European client this time is to customize small manual equipment for chip packaging for laboratory teaching. After multiple...

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