This device is highly suitable for use in university chip laboratories. We provide you with one-stop professional solution for semiconductor fabrication and various chips package equipments sulotion from China. The process engineer and electrical engineer from the user side have completed the acceptance inspection of the Mask Aligner -MDXN-G33D8 equipment.
Advanced Wedge Bonder Comparation Table Spe Minder-Hightech MDZW-WB1875 A certain American brand Wire Bonder Technical Specifications (Detailed) mode of operation Manual Operation Semi-automatic: Manual positioning and a...
Transistor Outline (TO) is a type of transistor package designed to allow for the formation of leads and surface mounting. As a packaged device, the ingress of dust or moisture under unsealed conditions can impair product performance, directly alter...
Vacuum reflow soldering furnace
Technical features: 1. Visual assisted positioning The TO Fully Automatic Visual Sealing Machine is equipped with an advanced visual system, which can identify the welding target in real time and perform precise positioning to ensure the coaxiality o...
Die Thickness Minimum :50um (Thinner Pending Discuss ) Ultra Thin Die Sorter MDND-120UT Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ...
Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine
Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching
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