Guangzhou Minder-Hightech Co.,Ltd.

Home
About Us
MH Equipment
Solution
Oversea Users
Video
Contact Us
Solution
Home> Solution
Small manual IC packaging equipment used in the laboratory: Plasma surface machine, Oven, Die bonder, Wire bonder.
25 Oct 2024

Small manual IC packaging equipment used in the laboratory: Plasma surface machine, Oven, Die bonder, Wire bonder.

Minder-Hightech is an integrated supplier of equipment for entire semiconductor packaging industry. The demand proposed by the European client this time is to customize small manual equipment for chip packaging for laboratory teaching. After multiple...

Get in touch

Inquiry Email WhatsApp WeChat
Top