Advanced Wire Wedge Bonder Comparation Table

Technical Specifications (Detailed)

mode of operation

1. Manual Operation
2. Semi-automatic: Manual positioning and automatic bond per wire

Manual operation only

loop Control

Fixed loop length and fixed loop height can be set online

Cannot fix the loop height or length, relies on manual operation, and has low consistency

Deformation monitoring

Real-time monitoring and control of weld deformation

Weld deformation cannot be monitored

Wire diameter

Suitable wire diameter range:

Gold thread 15-75um

Aluminum wire 18-80um,

Golden Ribbon:50um*12.7um-300um*25.4um

Suitable wire diameter range:

Wire diameter range: 18um to 50 um

Aluminum wire 18-80um,

Gold Ribbon

50um*12.7um-300um*25.4um

Bonding pressure

The bonding force is continuously adjustable between 1g and 300g, with online programming and digital processing, convenience to use

The bonding force uses dual-force mode, adjustable continuously between 10g and 150g, but not programmable

Thread break method

Platform wire breakage and wire clamp broken, eliminate fake bonding

Wire clamp broken

Array bonding wire

Yes, you can set equal spacing to complete the wiring function

not have

Parameter segment control

Have, this is helpful if bonding surface is not flat or chip is not flat mounted

not have

Deep access

The deep bonding depth can reach 19 mm

The deep bonding depth can reach 19 mm

Bonding Force Control

The use of voice coil motor for closed-loop control enables more effective protection of chip contact, while the soft landing mechanism better adapts to the 5880 soft substrate.

Wedge tools must be able to make a soft landing when contacting the chip

Wire spool

Suitable for both 1/2 inch spool and 2 inch spool

The standard configuration is a 1/2-inch spool.

Transducer frequency

Equipped with a 100KHz ultrasonic transducer, delivering a maximum power of 5W.

Equipped with a 63 KHz ultrasonic transducer, with a maximum power of 4W

Parameters are programmable

1^st bond and 2^nd bond can be independently programmed and controlled

1^st bond and 2^nd bond can be independently programmed and controlled

Handheld control

An 8:1 ratio (adjustable online) X, Y, Z micro joystick must be placed on the right side and operated with one hand.

Equipped with 8:1 scale X, Y, Z micro joysticks, which must be on the right side and can be operated with one hand.

display screen

Both Chinese and english display interface with touch color screen and process parameter prompts

LCD screen with English interface

worktable dimension

The system is equipped with an adjustable Z-axis height platform measuring approximately 25 cm×25 cm, with an adjustable range of about 18 mm.

The system features an adjustable Z-axis height platform measuring approximately 25 cm × 25 cm, with an adjustable range of about 16 mm.

antistatic countermeasure

The system provides comprehensive anti-static protection for the entire unit. Each module undergoes electrostatic treatment and multi-point grounding, with the system surface featuring a centralized grounding point. All coatings are anti-static.

The entire device must have anti-static protection, especially the system surface must have anti-static coating

microscope

Olympus Microscope

Olympus Microscope

Advantage

1. Can Set fixed loop length and fixed loop        height function
2. Monitor weld deformation
3. Segmented bonding

1. Long brand history, high market share

Disadvantage

1,brand since 2014 only, not so long as international one.

Technology old

Can not satisfy some special application field