Transistor Outline (TO) is a type of transistor package designed to allow for the formation of leads and surface mounting.
As a packaged device, the ingress of dust or moisture under unsealed conditions can impair product performance, directly altering the optical path and ultimately causing malfunction. Therefore, helium mass spectrometry leak testing during production is essential, as it involves leak testing the device's seal.
Due to the small size of packaged laser chip devices and the inability to evacuate or directly fill them with helium, TO helium mass spectrometry leak testing typically utilizes the backpressure method, a simple and reliable method. The TO packaged optical device is placed in a container at a certain pressure, and helium is introduced to compress it. After maintaining the pressure for a specified period, the device is removed and transferred to a vacuum container (leak test tank) connected to a helium detector for leak testing. Automatic testing verifies whether the device meets the package's airtightness requirements.
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