Vacuum reflow soldering furnace
Technical features: 1. Visual assisted positioning The TO Fully Automatic Visual Sealing Machine is equipped with an advanced visual system, which can identify the welding target in real time and perform precise positioning to ensure the coaxiality o...
Die Thickness Minimum :50um (Thinner Pending Discuss ) Ultra Thin Die Sorter MDND-120UT Project Parameters Equipment Name MDND-120UT multi-function die bonder Equipment Model MDND-120UT Bonding Accuracy/Angle ±20um, ...
Basic Theory of Fully Automatic Semiconductor Wire Ball Bonding Machine
Semiconductor Manufacturing / Plasma Etching / Reactive Ion Etching
Eutectic refers to the phenomenon of eutectic fusion in eutectic solder at relatively low temperatures. Eutectic alloys directly change from solid to liquid without going through the plastic stage, and their thermal conductivity, resistance, shear fo...
IC design, also known as integrated circuit design, has high precision in nano process technology, and the higher the accuracy, the more advanced the production process. When more transistors are integrated into the processor, the chip can achieve mo...
Low dimensional material etching refers to the process of etching two-dimensional materials (such as graphene, molybdenum disulfide, etc.) and one-dimensional materials (such as nanowires, nanotubes, etc.). The purpose of low dimensional material etc...
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
EN
AR
BG
CS
DA
NL
FI
FR
DE
EL
IT
KO
NO
PL
PT
RO
RU
ES
SV
TL
IW
ID
LT
SR
SL
UK
VI
ET
HU
TH
TR
FA
AF
MS
GA
IS
HY
AZ
KA
