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Video
- MH Company Video
- Semiconductor Device Fabrication
- IC/TO Package Video
- Vacuum Pack System
- Plasma Surface Treatments Video
- Winding machine
- Ultrasonic Welder
- Grinder and Polisher Video
- Soldering Dispensing Screwing Robots
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MD-S Series Automatic Semicon ductor Wire Ball Bonder
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Precision ± 5um, angle ± 0.5um, MEMS, sensor, high-precision Die bonding machine Die sorter
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Manual heavy wire bonder / Wire bonding machine / IC package equipments / Semiconductor equipment used in laboratories
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Chip packaging laboratory equipment：Oven, Plasma surface treatment, Wire bonder, Die bonder
