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Automatic wire bonder for IC TO package
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Die bonder draw line: X, O, +, *, choosing arbitrarily on the program.
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Customer training Die Bonder usage in China
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High precision die bonder use for high requirment die bonding
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MDB-7550 Manual Heavy Wire Wedge Bonder
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Semiconductor packaging equipment / Die bonder / Die bonding machine
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Automatic Ribbon Bonder
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MD-S Series Automatic Semicon ductor Wire Ball Bonder
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Precision ± 5um, angle ± 0.5um, MEMS, sensor, high-precision Die bonding machine Die sorter
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Manual heavy wire bonder / Wire bonding machine / IC package equipments / Semiconductor equipment used in laboratories
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Chip packaging laboratory equipment：Oven, Plasma surface treatment, Wire bonder, Die bonder
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