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1.1*1.1mm wafer Blue film ribbon, high-speed and high-precision Die bonder Die attach machine
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Semiconductor Secondary Packaging equipment Laser Vision Cap Opener / Non destructive repair Cover Opening machine
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Factory view. Die bonding machine is being debugged and ready for shipment.
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Multifunctional pull tester for wire bonding test MD-BT104 MD-BT101 Pull Tester for wire bonder
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TO eutectic die bonder
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Auto Deep Access Gold wire bonder Stud Ball
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MDZWSQW-1522 deep access Automatic Wire Wedge & ball Bonder for microwave product
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Automatic wire bonder for IC TO package
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Die bonder draw line: X, O, +, *, choosing arbitrarily on the program.
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Customer training Die Bonder usage in China
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High precision die bonder use for high requirment die bonding
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MDB-7550 Manual Heavy Wire Wedge Bonder
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