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Bidyo
- Minder-Hightech Company
- Wafer Fabrication
- IC/TO Pakete Video
- Hermetic Sealing Systems
- Plasma Cleaner
- Winding Machine
- Ultrasonic Welder
- Grinder At Polisher Video
- Mga Solusyon sa Laser
- Robot na Pang-dispensing, Soldering, at Screwing
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Semiconductor packaging equipment\/ Die bonder\/ Die bonding machine
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Awtomatikong Ribbon Bonder
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MD-S Series Awtomatikong Semikonduktor Wire Ball Bonder
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Presisyon ± 5um, anggulo ± 0.5um, MEMS, sensor, mataas na presisyon Die bonding machine Die sorter
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Manual heavy wire bonder / Wire bonding machine / IC package equipments / Semikonduktor na equipo na ginagamit sa mga laboratoryo
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Ekipmento sa laboratoryo para sa chip packaging: Oven, Tratamentong Plasma sa ibabaw, Wire bonder, Die bonder
