Today we are discussing a very cool piece of equipment called the Wafer Scriber. Have you heard of it before? Minder-Hightech Wafer surface activation is a special instrument used to cut wafers in very precise manner. Wafers are flat slices of a material such as silicon or other semiconductors that are used to produce electronic devices. Wafer scriber technology allows us to dice these wafers with high precision (10um-20um THK) into honeycomb that we can use as the beginning stages of our absorber. A honeycomb is a grid that we will later cut to fit into our plate.
One of the fantastic features of Wafer Scriber tools is their ability to leave ultra clean scribing lines on wafers. Scribing lines are basically very thin scratches on the top of the wafer produced before the cut is made. These lines provide a guide for the cutting process and ensure that the pieces are the correct size. Wafer Scriber -Removing saw damage and cutting wafers to size Wafer Scriber tools can protect your workpiece from blade depth variation by achieving perfect scribing lines to avoid sawing off center of desired cut.
Semiconductors play a very important role in many electronic devices we use everyday such as smartphones and computers. Minder-Hightech wafer plasma debonding help optimize chip manufacturing. With a Wafer Scriber, even precise and clean cuts are possible for wafers. This is to ensure semiconductors built from these wafers will function and be reliable.
Wafer manufacturing is a delicate job that needs much precision and attention to detail. That's where custom scribing solutions for wafer processing come in, and Minder-Hightech’s configurable Wafer Scriber units for a manufacturer's unique needs. Whether it's the spacing of the scribing lines or the rate of the cut through, our Wafer Scriber solutions are designed to give you the best results for each application.
Wafer Scriber technology enables manufacturers to significantly enhance the efficiency and precision of their wafer dicing. They can now saw wafers faster and with greater accuracy using Wafer Scriber tools. That also means more semiconductors can be made in less time, which can also in-turn decrease costs and increase productivity. The precision of the Minder-Hightech wafer lapping polishing is directly related to the proper functioning and quality of the semiconductor.
We offer a range of products. Wafer Scriber examples include Wire bonder and die bonder.
Minder-Hightech Wafer Scriber the semiconductor and electronic products sector in service and sales. We have 16 years of experience selling equipment. The company is committed to offering customers Superior, Reliable, and One-Stop Solutions for machinery equipment.
Minder Hightech comprises a team of highly educated engineers, professionals and staff with exceptional expertise and experience. The products we sell are being used in many Wafer Scriber all over the world, helping our clients improve their efficiency, cut costs and improve their product's quality.
Minder-Hightech Wafer Scriber become a well-known brand in industrial world, based on the years of machine solution experience and good relationship with oversea customers from Minder-Hightech. We created "Minder-Pack" which focuses on the manufacturing of packages solution, as well as other high value machines.
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
EN
AR
BG
CS
DA
NL
FI
FR
DE
EL
IT
KO
NO
PL
PT
RO
RU
ES
SV
TL
IW
ID
LT
SR
SL
UK
VI
ET
HU
TH
TR
FA
AF
MS
GA
IS
HY
AZ
KA
