Item |
MD150-RIE |
MD200-RIE |
MD200C-RIE |
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Product size |
≤6 inches |
≤8 inches |
≤8 inches |
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RF power source |
0-300W/500W/1000W Adjustable,automatic matching |
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Molecular pump |
-/620(L/s)/1300(L/s)/Custom |
Antiseptic620(L/s)/1300(L/s)/Custom |
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Foreline pump |
Mechanical pump/dry pump |
Dry pump |
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Process pressure |
Uncontrolled pressure/0-1Torr controlled pressure |
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Gas type |
H/CH4/O2/N2/Ar/SF6/CF4/ CHF3/C4F8/NF3/Custom (Up to 9 channels, no corrosive & toxic gas) |
H2/CH4/O2/N2/Ar/F6/CF4/ CHF3/C4F8/NF3/Cl2/BCl3/HBr(Up to 9 channels) |
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Gas range |
0~5sccm/50sccm/100sccm/200sccm/300sccm/500sccm/custom |
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LoadLock |
Yes/No |
Yes |
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Sample tem control |
10°C~Room tem/-30°C~100°C/Custom |
-30°C~100°C /Custom |
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Back helium cooling |
Yes/No |
Yes |
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Process cavity lining |
Yes/No |
Yes |
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Cavity wall tem control |
No/Roomtem~60/120°C |
Room tem-60/120°C |
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Control System |
Auto/custom |
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Etching material |
Silicon-based:Si/SiO2/SiNx··· IV-IV: SiC Magnetic materials/alloy materials Metallic material: Ni/Cr/Al/Au..... Organic material: PR/PMMA/HDMS/Organic film...... |
Silicon-based: Si/SiO2/SiNx...... III-V(注3): InP/GaAs/GaN...... IV-IV: SiC II-VI (注3): CdTe...... Magnetic materials/alloy materials Metallic material: Ni/Cr/A1/Au...... Organic material: PR/PMMA/HDMS /organic film... |
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It is applied to the etching of difficult to etch materials such as some metals (such as Ni / Cr) and ceramics, and the patternede tching of materials is realized by physical bombardment. |
It is used for etching and removal of organic compounds such as photoresist (PR)/ PMMA / HDMS / polymer |
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