Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.

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  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System
  • Wafer Stealth Laser Dicing System

Wafer Stealth Laser Dicing System

Mainly suitable for various semiconductor materials such as silicon, germanium, silicon carbide, zinc oxide, etc. Stealth dicing is a dicing method that focuses laser light inside the workpiece to form a modified layer, and divides the workpiece into chips by expanding the adhesive film and other methods. It is suitable for 4-inch, 6-inch, and 8-inch wafers.

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Product Description

Wafer Stealth Laser Dicing System

Laser invisible cutting, as a solution for laser cutting wafers, effectively avoids the problems of grinding wheel slicing. Laser invisible cutting is achieved by shaping a single pulse of pulsed laser through optical means, allowing it to pass through the surface of the material and focus inside the material. In the focal area, the energy density is high, forming a multi photon absorption nonlinear absorption effect, which modifies the material to form cracks. Each laser pulse acts equidistant, forming equidistant damage to form a modified layer inside the material. At the position of the modified layer, the molecular bonds of the material are broken, and the connections of the material become fragile and easy to separate. After cutting, the product is fully separated by stretching the carrier film, creating gaps between the chips. This processing method avoids damage caused by direct mechanical contact and rinsing with pure water. At present, laser invisible cutting technology can be applied to sapphire/glass/silicon and various compound semiconductor wafers.
Application
The fully automatic wafer laser stealth dicing equipment is mainly suitable for various semiconductor materials such as silicon, germanium, silicon carbide, zinc oxide, etc. Stealth dicing is a dicing method that focuses laser light inside the workpiece to form a modified layer, and divides the workpiece into chips by expanding the adhesive film and other methods. It is suitable for 4-inch, 6-inch, and 8-inch wafers.
Feature
FFC loading and unloading methods include material retrieval, dicing, and returning materials to their original positions.
Multi camera visual capture of wafer edges and feature point positioning, automatic alignment, and automatic focusing; High precision motion platform.
Fully automatic loading and unloading, stable and reliable optical path, high-precision visual system, high processing efficiency.
Software system that is easy to operate and fully functional.
Optional focus: single focus, dual focus, multi focus (optional).
Product Structure
Dicing Samples
Accessory
Specification
Processing size
12 inches, 8 inches, 6 inches, 4 inches
Processing method
Cut/back cut
Processing material
Sapphire、Si、GaN and other brittle materials
Wafer thickness
100-1000um
Maximum processing speed
1000/s
Positioning accuracy
1um
Repeat positioning accuracy
1um
Edge collapse
< 5um
Weight
2800kg
Packing & Delivery
Company Profile
Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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