Creating microelectronics involves a lot of steps that should be carried out with caution. Wafer bonding is one such critical step. In reality, wafer bonding is putting two thinness materials or wafers as per their industry term together. It is important that whatever the two-points touch, hold a very strong adhesive property with one another for this process to work effectively. This is where surface activation comes in to play which aids bonding.
Surface activation of the wafer is a specific method applied to help increase adhesion or stickiness in wafer. Plasma treatment, UV/ozone treatment or chemical functionalization are some approaches that can be used to activate the surface. These techniques are different from each other and use to make wafer surface suitable for bonding.
It also serves to improve the quality of a microelectronic device. They help the wafers really all well together so that they reduce likelihood of problems like delamination. It will therefore perform better and last longer, hinting at increased robustness in whatever newfangled gadget it calls home.
Apart from enhancing the bond and quality of the device, surface activator also helps sprinkle wafer face with cleanliness. This way when you have an activation process done on the surface, any kind of dirt or contaminant which is not desirable can be taken out. This in turn should lead to a better, flatter surface from which they can print microelectronics on.
Finally, surface activation can make the wafer’s surface in a smooth nature. If we are using glue to stick two surfaces together then if the surface is too rough or bumpy it could be difficult for them to bond properly. A polishing or activation process can be performed to minimize roughness on the wafer surface that improves bonding and connection strength.
There are several concepts to consider when it comes to the science of wafer surface activation techniques. And one of these concepts is Surface Energy. For reference, Surface energy: the amount of energy used to produce a new surface. When two surfaces meet they bind according to their surface energy.
These surface activation techniques essentially provide some energy to the wafer, by increasing its surface energy. Such makes it easier for the wafer to stick onto another surface firmly, Methods in such as plasma treatment, UV/ozone treatment and chemical functionalization all generate active sites to a different degree increasing the surface energy of the wafer which is crucial for successful bonding.
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