Wafer grinding and polishing systems are necessary instruments for semiconductor industry to generate thin and flat wafers for electronic facilities. At Minder-Hightech, we design and supply state-of-the-art equipment that will enable manufacturers to achieve the ideal wafer thickness, and smoothness, ultimately providing a quantum shift in the production of wafers. Read how our leading edge equipment is bringing new levels of productivity and innovation to the semiconductor industry.
One of the most critical problems in the semiconductor process is controlling uniform wafer thickness. Manufacturers have unprecedented control of overall wafer thickness with the wafer grinding machine. Our state of the art equipment processes the variety of wafers we offer to the specific size you need, quickly turning the wafers around and getting them on your way for use in electronics. Uniform Thickness for an Optimal Use of Materials When the thickness of all wafers is the same, waste is minimized and production efficiency is enhanced.
Aside from being the correct thickness, smooth surface is important to the operation of electronic components. Minder-Hightech's wafer polisher machines utilize innovative methods to create metrologically flat wafers at the highest smoothness and reduced surface defects while increasing the wafer performances. With our leading-edge technology our partners are able to manufacture top-quality wafers that meet the very high specifications of the semiconductor industry.
Minder-Hightech is a technology leader in wafer grinding equipment. Our experts always exercising R&D to develop new technologies to make grinding process more precise and efficient. We help manufacturers stay in the forefront of the industry with our equipment and advancements by keeping the latest and greatest incorporated. With the advanced wafer grinder solutions, manufacturers now have the ability to develop high quality and uniform wafers.
In the production of semiconductors, due to the cost of manufacture and lead time leadings to an interest calculation, efficiency plays an important role. Wafer polishing equipment, produced by Minder-Hightech, will increase the productivity by shortening the polishing time and increasing the yield rates. Our machine has got the advanced automatic polishing functions, so as to relieve the staff from the manual and reduce the deviation. Thanks to the advanced wafer polishing machines, manufacturers of the above components are able to optimize their respective process chains and to cut costs on a larger scale.
Minder-Hightech represents the semiconductor and Wafer grinding and polishing equipment products business in service and sales. We have more than 16 years of experience in the field of equipment sales. The company is committed to provide customers with Superior, Reliable, and One-Stop Solutions for machinery equipment.
We offer a Wafer grinding and polishing equipment range of products, including wire bonder and die bonder.
Minder Hightech comprises a team of highly educated engineers, professionals and staff with exceptional expertise and experience. The products we sell are being used in many Wafer grinding and polishing equipment all over the world, helping our clients improve their efficiency, cut costs and improve their product's quality.
Minder-Hightech is now a very well-known brand in the industrial world, based on decades of experience with machine solutions and good relationship with oversea customers of Minder Hightech, we Wafer grinding and polishing equipment "Minder-Pack" which focuses on the manufacturing of packages solution, as well as other high value machines.
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