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Video
- Minder-Hightech Company
- Wafer Fabrication
- IC/TO Package Video
- Hermetic Sealing Systems
- Plasma Cleaner
- Winding Machine
- Ultrasonic Welder
- Grinder and Polisher Video
- Laser Solutions
- Soldering Dispensing Screwing Robots
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Precision ± 5um, angle ± 0.5um, MEMS, sensor, high-precision Die bonding machine Die sorter
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Chip packaging laboratory equipment：Oven, Plasma surface treatment, Wire bonder, Die bonder
