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Packaging process suitable for high-precision multi chip SMT : Fully Automatic High-precision Eutectic Die Bonder Eutect
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To Package equipment / TO die bonder / TO die sorter / Die Attach Machine
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Die attach machine / Die bonder
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TO die attach machine / TO die sorter
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1.1*1.1mm wafer Blue film ribbon, high-speed and high-precision Die bonder Die attach machine
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Factory view. Die bonding machine is being debugged and ready for shipment.
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TO eutectic die bonder
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Die bonder draw line: X, O, +, *, choosing arbitrarily on the program.
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Customer training Die Bonder usage in China
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High precision die bonder use for high requirment die bonding
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Semiconductor packaging equipment / Die bonder / Die bonding machine
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Precision ± 5um, angle ± 0.5um, MEMS, sensor, high-precision Die bonding machine Die sorter
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