MDSY-BC6076 Wafer level Ball Correct System , China MDSY-BC6076 Wafer level Ball Correct System Manufacturers, Suppliers, Factory

Product Description

Wafer level ball correct system MDSY-BC6076

MDSY-BC6076 Wafer level Ball Correct System manufacture

Stage size	8, 12[inch]	MAX 300x300[mm]
Ball size	Ф50[um]~ Ф300[μm]
Min. ball pitch	90[um](Ф50[um] ball)
Alignment accuracy	+15[um]
Dimensions	3,065W x 1,700D x 1,650H[mm]
Weight	Approx. 2,900[kg]
Loader/ Unloader	Open cassette, FOUP	Customizable

MDSY-BC6076 Wafer level Ball Correct System factory

MDSY-BC6076 Wafer level Ball Correct System details

Excluding the ball head:
Remove balls with abnormal positions from the wafer through vacuum and rotation.
The suction state of the ball is detected through a flow meter for analog analysis of flow meters with different ball diameters.
Different flow rates adapt to different suction states of ball diameters.
Residual ball cleaning mechanism: By rubbing with a brush, the absorbed balls are collected and recycled.

MDSY-BC6076 Wafer level Ball Correct System supplier

Feature

1. Applicable wafer: 12’’ wafer & 8’’ wafer
2. Tact time
Inspection time: 0.55 [sec/field of view]
Repair time: 2.8 [sec/ball] (including Flux transfer)
3. Ball size / pitch:Φ60/100(Min)~ Φ300 [um]
4. Mounting accuracy: Less than ±15 [um]

Packing & Delivery

Company Profile

We have 16 years of experience in equipment sales. We can provide you with One-stop Semiconductor Front-end and Back end Package Line equipments professional solution from China.