Full Automatic Wafer Thinning Machine , China Full Automatic Wafer Thinning Machine Manufacturers, Suppliers, Factory

Product Description

MDTS-WT2200
Fully Automatic Wafer Thinning Machine

Full Automatic Wafer Thinning Machine supplier

Feature

1．Excellent compatibility：Maximum8-inch compatibility
2．Operation mode：Fully automatic mode processing
3．Automaticmode fordrying inand out, with cleaning and drying functions
4．Using specialized grinding wheels
5．Equipped with wheel overload waiting function

Specification

Model	MDTS-WT2200
Number of thinning axes	2
Number of workbenches	3, Index method
Grinding wheel spindle	Number of air spindles: 2 Spindle motor: 7.5kW variable frequency motor Speed: 0~6000rpm, steplessly adjustable Grinding wheel specification: Φ203mm Grinding wheel type: diamond grinding wheel
Grinding wheel feeding system	Quantity: 2 sets Feed system control method: LM guide rail and ball screw combination Drive motor: servo motor Minimum feed speed: 0.1um/sec Maximum feed speed: 50mm/sec
Workbench	Quantity: 3, Index mode Spindle motor: Servo motor Speed: 0~300rpm, steplessly adjustable Adsorption method: Vacuum adsorption
Workbench turntable	Drive mode: servo motor Rotation range: 0~240° Positioning shape: sensor assisted positioning
Automatic thickness measurement system	Measurement method: IPG contact online real-time measurement Number of measuring heads: 2 Measuring sensor: 0.1um level sensor
Automatic loading/ unloading system	Box type: 6-8inch Cassette, 25 layers Automatic loading/unloading method: wafer manipulator is used to ensure thin wafers are transported without damage Wafer thickness: 150um-1000um
Workbench cleaning function	Cleaning method: Oilstone polishing &DI water+air two-fluid flushing
Automatic cleaning/ drying system	Cleaning: DIW nozzle cleaning Drying method: Blowing +drying Speed: max1000rpm steplessly adjustable
Static elimination system	Ion bar orion fan
Spindle chiller	Temperature: 18-22°C Flow rate: 4~8L/min
Control system	Control system: PCcontrol system, touch screen 3-coloralarm light Chinese/English human-machineinterface
Maximum wafer size	Maximum compatible with 8 inches
Speed range	0~6000 RPM
Z-axis travel	160mm
Z-axis feed speed	0.1~100um/sec
Z-axis fast retract speed	50mm/sec
Z-axis resolution	0.1um
Online thickness measurement range	0~1800um
Online thickness measurement resolution	0.1um

Packing & Delivery

Full Automatic Wafer Thinning Machine factory

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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