Full Automatic Wafer Thinning Machine , China Full Automatic Wafer Thinning Machine Manufacturers, Suppliers, Factory

Product Description

MDTS-WT2200
Fully Automatic Wafer Thinning Machine

Full Automatic Wafer Thinning Machine supplier

Feature

1．Excellent compatibility：Maximum8-inch compatibility
2．Operation mode：Fully automatic mode processing
3．Automaticmode fordrying inand out, with cleaning and drying functions
4．Using specialized grinding wheels
5．Equipped with wheel overload waiting function

Specification

Model	MDTS-WT2200
Number of thinning axes	2
Number of workbenches	3, Index method
Grinding wheel spindle	Number of air spindles: 2 Spindle motor: 7.5kW variable frequency motor Speed: 0~6000rpm, steplessly adjustable Grinding wheel specification: Φ203mm Grinding wheel type: diamond grinding wheel
Grinding wheel feeding system	Quantity: 2 sets Feed system control method: LM guide rail and ball screw combination Drive motor: servo motor Minimum feed speed: 0.1um/sec Maximum feed speed: 50mm/sec
Workbench	Quantity: 3, Index mode Spindle motor: Servo motor Speed: 0~300rpm, steplessly adjustable Adsorption method: Vacuum adsorption
Workbench turntable	Drive mode: servo motor Rotation range: 0~240° Positioning shape: sensor assisted positioning
Automatic thickness measurement system	Measurement method: IPG contact online real-time measurement Number of measuring heads: 2 Measuring sensor: 0.1um level sensor
Automatic loading/ unloading system	Box type: 6-8inch Cassette, 25 layers Automatic loading/unloading method: wafer manipulator is used to ensure thin wafers are transported without damage Wafer thickness: 150um-1000um
Workbench cleaning function	Cleaning method: Oilstone polishing &DI water+air two-fluid flushing
Automatic cleaning/ drying system	Cleaning: DIW nozzle cleaning Drying method: Blowing +drying Speed: max1000rpm steplessly adjustable
Static elimination system	Ion bar orion fan
Spindle chiller	Temperature: 18-22°C Flow rate: 4~8L/min
Control system	Control system: PCcontrol system, touch screen 3-coloralarm light Chinese/English human-machineinterface
Maximum wafer size	Maximum compatible with 8 inches
Speed range	0~6000 RPM
Z-axis travel	160mm
Z-axis feed speed	0.1~100um/sec
Z-axis fast retract speed	50mm/sec
Z-axis resolution	0.1um
Online thickness measurement range	0~1800um
Online thickness measurement resolution	0.1um

Packing & Delivery

Full Automatic Wafer Thinning Machine factory

To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.

Company Profile

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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