Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter
  • Wafer Leavel Laser Soldering Ball Mounter

Wafer Leavel Laser Soldering Ball Mounter

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Product Description

Laser Solder Ball Placement Machine

The automatic laser tin ball welding machine is specially designed to meet the precision welding needs of camera modules and other components. It is equipped with fiber lasers, marble workbenches, and industrial control systems, and is highly integrated with an automatic ball spraying mechanism to achieve synchronization between ball spraying and laser welding. It is also equipped with a dual station interactive feeding system to achieve efficient automatic welding during loading, unloading, automatic positioning, and welding. This greatly improves production efficiency and can meet the microelectronic welding needs of precision components such as BGA chips, 5G optical communication devices, camera CCM modules, VCM coil modules, and contact basin frames. It has a wide range of applications.
 
The laser single station laser tin ball soldering machine is specially designed to meet the needs of precision welding, equipped with a high-precision visual positioning system, a marble horizontal worktable, and a real-time quality monitoring module. During the welding process, it can accurately control key parameters such as soldering amount and soldering time, and control the size and shape errors of each solder joint within the micrometer range. Capable of accurately handling welding tasks with small spacing, the minimum ball size can reach 70um to 2000um, and the motion repetition accuracy can reach ± 3um. Widely used in automatic soldering processing of high-precision semiconductor chips, wafers, hard disk heads, etc.

Equipment characteristics:

Suitable for ball placement welding on solder pads ranging from 200-760um;
Helpless soldering flux, no cleaning, cost saving;
Stable tin content, good consistency, and improved welding quality;
Dual station operation, saving loading and unloading time;
Cooperate with CCD image positioning system to achieve precise alignment of welding positions;
Optional post weld inspection and online automatic ball placement function.

Equipment characteristics:

Suitable for soldering pads with a thickness of 50-2000um without the use of soldering flux, no need for cleaning, and cost
savings; Stable tin content and good consistency improve welding quality. Combined with CCD image positioning system, it achieves precise alignment of welding positions. Optional post weld detection and other customized functions are available.

Advantages:

1. High precision: The automatic ball placement system can accurately control the placement position of solder balls, with errors controlled within a very small range, ensuring that each solder ball can accurately land in the predetermined position, greatly improving the welding yield.
2. High efficiency: Compared to manual ball planting, automatic ball planting equipment can achieve fast and continuous ball planting operations, greatly shortening the production cycle, improving production efficiency, and meeting the needs of large-scale production.
3. Good consistency: During the automatic ball planting process, the placement conditions of each tin ball are consistent,
avoiding possible differences caused by manual operation and ensuring the stability and consistency of product quality.
4. Save manpower: It reduces the large amount of manpower required for manual ball planting, lowers labor costs, and also avoids quality problems caused by factors such as personnel fatigue.

Application industry:

Consumer electronics: motherboard soldering, camera module soldering, etc. in products such as smartphones, tablets, and smartwatches. These products have extremely high requirements for the integration and welding accuracy of components, and laser solder ball welding machines can meet their precision welding needs
Semiconductors: In processes such as chip packaging and integrated circuit manufacturing, laser soldering machines can be used to connect chips to substrates, ensuring stable and reliable electrical performance.
Automotive Electronics: Welding of sensors, controllers, and other components in automotive electronic control systems. The high precision and reliability of laser solder ball welding machines can ensure the normal operation of automotive electronic equipment in complex environments.
Medical equipment: Welding of micro electronic components in medical equipment requires extremely strict welding quality and safety. Laser solder ball welding machines can meet these demanding requirements, ensuring the performance and reliability of medical equipment.
Specification
laser power
100W150W200W optional
Laser wavelength
1064nm
Cooling method
Fully air-cooled
Tin ball diameter
200-760um
control mode
PC+dedicated control software
Positioning method
CCD positioning
Repetitive accuracy
5um
Number of workstations
Dual station
Welding range
Single workstation 200x200mm
Processing efficiency
≈ 3 balls/S
Nozzle alignment
Automatic correction
Power Supply
AC220V50Hz
Temperature and humidity
22-30 ° C 20-70% (non condensing)
weight
1200kg
External dimensions
1050(L)*1380(W)*1700(H)mm
laser power
20W~300W optional
Laser wavelength
1064nm
Cooling method
Fully air-cooled
Tin ball diameter
50-2000um segmented options
control mode
PC+dedicated control software
Positioning method
CCD positioning
Repetitive accuracy
3um
Number of workstations
Single workstation
Welding range
300x300mm
Processing efficiency
≈ 3 balls/S
Nozzle alignment
Automatic correction
Power Supply
AC220V50Hz
Temperature and humidity
22-30 ° C 20-70% (non condensing)
weight
1200kg
External dimensions
1200(L)*1250(W)*1860(H)mm
Packing & Delivery
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the
equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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