Laser Decapsulation Machine MDSL-LD3030

1. Application Areas: Laser decapsulation system designed for precise and efficient removal of epoxy and plastic molding materials.
2. Laser Processing Principles: Laser processing technology focuses light energy through a lens to form a high-energy-density laser beam. Leveraging the interaction between the laser beam and matter, it performs cutting, engraving, welding, surface treatment, drilling, cleaning, and micromachining on materials (including metals and non-metals).
As an advanced manufacturing technology, laser processing has been widely applied in key sectors of the national economy, including automotive, electronics, electrical appliances, aviation, metallurgy, and machinery manufacturing. It plays an increasingly important role in improving product quality, increasing productivity, facilitating automation, and reducing pollution and material consumption. Across various fields, laser cutting, laser marking, and laser welding are the most widely used.
The laser decapsulation machine easily and conveniently removes the encapsulation layer from plastic-encapsulated semiconductor devices, exposing the lead frame on the substrate. It features a fully graphical user interface for simple control. It can easily handle full-surface, targeted, or even flat decapsulation of plastic encapsulation material, significantly reducing the amount of acid used and the time required for chemical decapsulation, while maximizing the success rate of decapsulation. It is capable of decapsulating a variety of plastic-encapsulated devices, including integrated circuits and discrete components. It also offers excellent decapsulation performance for gold, copper, aluminum, and silver wire encapsulation.