Reel to Reel Die Bonder for SIM Cards , China Reel to Reel Die Bonder for SIM Cards Manufacturers, Suppliers, Factory

Reel to Reel Die Bonder for SIM Cards

Overview of Device Functions:

This model is a solid crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging.

The MDAX-860 fully automatic high-speed solidification machine is composed of multiple sub unit modules:

Linear bonding head+ suction nozzle rotating structure
Multi ejector pin design for easy adaptation to different types of wafer sizes
1.3 million resolution visual system for chips and frameworks
Servo direct connected high-precision adhesive coating system
Material box feeding and receiving (customizable online mode)
Solid crystal workbench module, using linear motor and high-precision grating ruler
Mapping function

Equipment Performance Characteristics:

High speed: According to customer process requirements, achieve the fastest speed in the industry;
Placement accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip);
Patch angle accuracy: ± 0.5 °
Low pressure monitoring: adjustable from 30g to 200g, with controllable error.
Multiple structural configurations of Bangtou;
Multiple image positioning schemes (appearance, feature points, edge finding, circle finding);
Control and detection of the diameter of the first adhesive point;
Connection mode device, multiple serial devices complete device packaging.

Technical Specifications:

UPH	0.5-3K PCS（Chip related）
X. Y chip position accuracy	± 10um
Chip angle accuracy	± 1°
Patch pressure range and accuracy	30~200g ±10%
Ring size and adaptability	8 inch 、6inch 、Gel-PAK 、Wafer-PAK
Camera maximum accuracy	1um
Camera field of view	1.0mm~8mm
Number of suction nozzles	2PCS
Lower visual inspection	5 megapixel high-definition camera, image recognition
Number of thimbles	1PCS, multiple thimbles (optional)
Attachment materials	PD &PD Array, LD&LD Array, Driver, TIA, COC, TEC, Wedge, PLC, Sub mount , resistor, capacitor, etc.
Vehicle size range	Width:40mm~80mm Length:120mm~170mm
Console height	950mm ±30mm
Connection method of upstream and downstream equipment	SMEMA
Power supply	AC 220V/50Hz
Consumption	800 W
Compressed gas	4~6 Bar
External dimensions (WXDXH) (excluding loading and unloading machines)	153012301900mm
Net weight	1400 Kg

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Reel to Reel Die Bonder for SIM Cards

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