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Guangzhou Minder-Hightech Co.,Ltd.
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Home> Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder
  • Automatic TO Laser Tube Wire Bonder

Automatic TO Laser Tube Wire Bonder

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Product Description

Automatic TO Laser tube wire bonder MD-KTO94

1.  The machine is suitable for TO56 laser diode packaging
For TO56 laser diode vertical and side welding, automatic loading and unloading welding equipment.

2.  High compatibility
Welding TO56 laser diode, long and short pin compatible. Front side welding.

3.  High stability
Bangtou adopts the optical deletion ruler imported from Germany and the most advanced voice coil motor, the welding action is high speed and stable.

4.  High processing speed
Welding cycle: 80ms/W
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Specification
Visual system
Machine vision lens:
1.8 times
Stereomicrolens:
15 times, 30 times
Ring lighting:
White super bright LED light with adjustable brightness
Working light:
Maximum power 3W
pelletizing
Lighting method:
Negative electrons spark into balls
Ball burning time:
0~25.5ms
Bulb burning current:
0~20mA
Ultrasonic generator
Ultrasonic power 0 ~ 1.0 W
Welding time:
(1) First welding time: 0~255ms
(2) Second welding time: 0~255ms
Ultrasonic frequency
138KHz
Welding process frequency regulation
Automatically capture and track the resonant frequency of the transducer
Equipment details
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine details
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Our Factory
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine factory
Packing & Delivery
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine supplier
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture
Semiconductor production automatic TO package wire bonder laser diode packaging ultrasonic gold wire ball bondingg machine manufacture

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