Automatic Big Area Deep Access Wedge Bonder

Launching the Big area deep access wedge gold wire bonder wire bonding machine for Semiconductor Packaging LED IC package the solution semiconductor ultimate LED IC packaging. 

 This advanced bonding device is engineered with advanced level features that streamline the production procedure, causing increased effectiveness and manufacturing time paid down. The Minder-Hightech Big area deep access wedge gold wire bonder wire bonding machine for Semiconductor Packaging LED IC package was made having an area big is working enabling deep usage of the bonding website. Thus, giving accuracy cable bonding of Light-emitting Diode IC packages, ensuring constant and gratification dependable. 

 Furthermore, the bonding device is crafted insurance firms a silver robust feeding procedure that guarantees smooth and uninterrupted procedure through the production procedure. 

 The Big area deep access wedge gold wire bonder wire bonding machine for Semiconductor Packaging LED IC package is a device incredibly versatile can handle many different cable bonding applications. It is perfect for higher level semiconductor packaging and operations, including bonding high-density interconnects and cable bonding for higher level memory packaging. One of the standout highlights of this cable bonding device is its bonding mind high level design. Its engineered having a wedge bonding head that optimizes the bonding procedure, delivering constant, durable, and cable dependable. 

Moreover, this bonding device is made by having an adaptive exclusive algorithm that guarantees an increased level of accuracy and quality in to the bonding procedure. This algorithm guarantees cable that works, even in challenging environments, eventually reducing the possibility of manufacturing problems. The Big area deep access wedge gold wire bonder wire bonding machine for Semiconductor Packaging LED IC package is not hard to make use of and maintain. 

 The program user-friendly simple and easy quick corrections, ensuring performance constant. Furthermore, this cable bonding device is established with durable elements that want minimal upkeep, decreasing downtime and ensuring top performance for the production requirements. 

Product Description

Full-automatic deep access big area ball bonding machine

Real-time deformation monitoring
Real-time ultrasonic energy monitoring
Arc control capability of fixed length and height
Piezoelectric ultrasonic motor tail wire control mechanism
Deep cavity bonding capacity of 16mm and 19mm cleat length
HD bonding head maintenance image assistant tool
Large area of coal connection area

Feature

Real time deformation monitoring;
Real time ultrasonic energy monitoring;
Fixed length and fixed height arc control capability;
Tail wire control mechanism of piezoelectric ultrasonic motor;
Deep cavity bonding capacity of 16mm and 19mm cleaver length;
HD bonding head maintenance image auxiliary tool;
Large welding area.

Specification

Scope of application	Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc
Welding accuracy	±3um
Welding line area	305mm in X direction, 457mm in Y direction, 0~180 ° rotation range
Ultrasonic range	0~4W control accuracy, ladder flexible application capability
Arc control	Fully programmable
Cavity depth range	Maximum 12mm
Bonding force	0~220g
Cleave length	16mm、19mm
Type of welding wire	Gold thread (18um~75um)
Welding line speed	≥4wires/s
operating system	Windows
Net weight of equipment	1.2T
Installation requirements
input voltage	220V士10%@50/60Hz
Rated power	2KW
Compressed air requirements	≥0.35MPa
area covered	Width 850mm * depth 1450mm *height 1650mm

Scope of application	discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc
Type of welding wire	gold wire (12.5um-75um)
Arc length and arc height of welding line	fully programmable
Welding wire accuracy	± 3um, @ 3sigma
Ultrasonic	0 ~ 5W control accuracy, step flexible application ability
Pressure	0-200g, mechanical resolution 0.1g, force control repeatability
Suitable cleaver length	16mm, 19mm
Welding area	large area: 330mmx432mm, ± 220 ° rotation range
Welding wire speed	3 ~ 7wire / S (@ 25um gold wire & 1mm wire length)
Operating system	Windows
Net weight of equipment	1350kg

Equipment details

Factory

Packing & Delivery

Company Profile

We have 16 years of experience in equipment sales ，

and can provide you with a one-stop IC Package Line Equipment solution.