Guangzhou Minder-Hightech Co.,Ltd.
EN
Guangzhou Minder-Hightech Co.,Ltd.
Get Quote

Guangzhou Minder-Hightech Co.,Ltd.

Home
About Us
MH Equipment
Solution
Oversea Users
Video
Contact Us
Home> Wire Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder
  • Automatic Semiconductor Wire Ball Bonder

Automatic Semiconductor Wire Ball Bonder

Get a Free Quote

Products Description

MD-S series Automatic Semiconductor Wire Ball Bonder

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED supplier

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED details

Md-S808 838 automatic semiconductor wire ball welder
Speed: 21W/S for 2mm
Welding line area：56*80mm
Leadframe width：28-90mm
Applications
IC(SOP, SOT, DIP, BGA, COB等。）
LED(SMD, COB等）

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED supplier

Advantage:
Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumption
The chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution
High resolution 0.1um worktable, + / - 2um welding line accuracy
High resolution EFO
Full closed loop force control 2.5mil copper wire
Optional Automatic conversion of product types
Specification
Specification
Bonding Capability
48ms/w(2mm Wire Length) 
Bonding Speed
+/-2Ym
Wire Length
Max 8mm
Wire Diameter
15-65ym
Wire Type
Au, Ag, Alloy, CuPd, Cu
Bonding Process
BSOB/BBOS
Looping Control
Ultra Low Looping
Bonding Area
56*80mm
XY Resolution
0.1um
Ultrasonic Frequence
138KHZ
PR accuracy
+/-0.37um
Applicable Magazine
L
120-305mm
W
36-98mm
H
50-180mm
Pitch
Min 1.5mm
Applicable Leadframe
L
100-300mm
W
28-90mm
T
0.1-1.3mm
Conversion Time
Different Leadframe
Same Leadframe
Operation Interface
MMI Language
Chinese, English
Dimension, Weight
Overall Dimension W*D*H
950*920*1850mm
Weight
750KG
Facilities
Voltage
190-240V
Frequency
50Hz
Compressed Air
6-8Bar
Air Consumtion
80L/min
Our Factory

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED details

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED manufacture

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED factory

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED manufacture

Product Details

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED details

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED supplier

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED supplier

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED manufacture

We have 16 years of experience in equipment sales ，
and can provide you with a one-stop IC Package Line Equipment solution

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED factory

If you want to konw more, please contact our engineer:

MD-S automatic semiconductor machine wire ball bonder wire ball bonding machine for IC LED supplier

More Products

Inquiry

Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved

Privacy Policy

Inquiry Email WhatsApp WeChat
Top
×

Get in touch