Multi-chip High Speed and Precision Die Bonder

Product Overview:

1. Targeted solutions for micro-assembly of multi-chip, multi-material, and multi-geometry chips.

2. Graphical display and guided programming, guided CAD compatibility, and efficient user product import.

3. Database-based process parameter interaction, high adaptability to multi-chip processes.

4. Flexible and vision-based pick-and-place mode, stronger adaptability to sensitive materials (or interfaces) of chips.

5. High precision, high speed, and high responsiveness combined, stronger adaptability to extreme requirements such as micro-chips and "adhesive-free" chip placement.

6. Compatibility with dispensing equipment platforms, control systems, and data formats.

7. High adaptability for multiple product types, rapid product switching, convenient capacity matching, and extreme process requirements.

Product Features:

1. Optical imaging system including RGB, adaptable to various materials such as IC, FR4, HTCC, and LTCC.

2. Multiple reference points and automatic height adjustment for complex device adaptation.

3. Composite process modes, including dipping and flipping, suitable for ultra-large-scale SIP packaging.

4. Micro-chip placement (without adhesive), expanding multi-IC eutectic bonding applications.

5. High-speed direct-drive common platform technology for stability, accuracy, and speed.

6. Self-developed "high-speed, high-precision, low-disturbance" platform with low maintenance and guaranteed precision.

7. Process data information tracking and traceability.

8. Flexible and visual detection matching for GaN and GaAs.

9. Process-level comprehensive positioning accuracy of ±3um@3σ (@2KUPH).

10. 10um-level chip cascading placement.

11. PBI precision-level post-bonding inspection.

12. Low impact & repeatability of ±0.5g, with a minimum 5g operating placement pressure system.

13. Graphical guided process programming for rapid product introduction.

14. Guided CAD compatibility for rapid design import.

15. Database-based process parameter interaction for high adaptability to complex packaging.

16. Program, subprogram, and parameter library series product data compatibility.

Product Specifications:

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.