Model: MDB-2575
Application: Digital tube, lattice, integrated circuit soft package, integrated circuit, transistor, semiconductor devices ect.


Electric Requirement |
220VAC±10%、50HZ、be sure connected to ground |
Wire Diameter |
25~75μm |
Ultrasonic Power |
0-3W, 60kHz, two channel. can be set separately of the two point |
Bond Time |
5-200ms,two channel |
Bond Force |
10-60g,two channel |
Span Between First Bond To Second Bond By Automatic Mode |
0-10mm(motorized) |
Bond Radian |
0-6mm(motorized) |
Jig Moving Area |
Φ16mm |
Mouse Hand |
20*20mm |
Dimension |
600*560*390mm |
Digital Camera |
optional |
Weight |
36kg |




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