MDJL-GJJ0225 Manual Eutectic Chip Mounter
Features:1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc.2. Realize the soft contact of the suction nozzle, effectively solve the problem of the active area such as the air bridge on the surface of the GaAs chip 3. Non-damage flattening adjustment for uneven patch or large-sized chips 4. Dispensing and patch are integrated, integral, convenient or double-head patch function, improve efficiency.
Application Areas: Microwave Devices, Automotive Electronics, Sensors, Hybrid Circuits, MEMS Circuits, Optoelectronic Devices/Modules, COB Modules, RF Devices/Modules, Separation Devices, MCM.
Introduction: Epoxy adhesive chip mounting equipment, suitable for bonding and mounting multi-chip epoxy chips of various devices.
1. Multi-size chip epoxy bonding 2. 360° Q-axis rotation 3. Simultaneous chip picking, placement, and eutectic bonding 4. 1:8 ratio operating handle for precise chip positioning 5. Programmable vibration friction frequency and amplitude