Equipment Features
1. This equipment is designed for laser trimming of high-end semiconductor wafers.
2. Equipped with a laser imported from the United States, it delivers exceptional stability during laser trimming.
3. Features an anti-interference, high-precision linear motor XY stage with a grating scale, effectively mitigating machine-induced interference on products.
4. Incorporates a 12-megapixel CCD camera for precise positioning.
5. Features achromatic imaging technology and image recognition positioning capabilities.
6. Features GPIB and other external interfaces for connecting external instruments for measurement or resistance adjustment
7. Marble base ensures excellent machine stability
Technical Parameters
Model |
MDSG-LT74 |
Laser wavelength |
1064/355nm |
Laser power |
6W/4W |
Typical Spot Size |
25-35μm |
Focusing Method |
Automatic, computer program controlled. |
Cooling Method |
Air cooling |
Laser Beam Movement Range |
27mm X 27mm |
Movement resolution |
0.76μm |
Repeat Positioning Accuracy |
±2.5µm |
Movement Mode |
Anti-interference grating ruler linear motor |
Motion Range) |
300mmx300mm |
Repeat Positioning Accuracy |
±1µm |
Resistance Measurement Method |
4-wire measurement |
Resistance Measurement Accuracy |
±0.02% (medium resistance) |
Resistance Measurement Range |
0.1Ω-50MΩ |
Measurement Speed |
4µs/measurement |
Zero and Full-Scale Error Correction |
Automatic correction |
Probe Definition |
Programmable arbitrary setting |
Interface |
GPIB |
Equipment Dimension |
1430 x 913 x 1747mm |
Weight |
617Kg |
Operating Conditions (Water, Electricity, Gas) |
Humidity: <70%; Power supply: AC 220V 2.5kW; Compressed air: <0.6MPa, <40L/min |
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
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