Guangzhou Minder-Hightech Co.,Ltd.
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Guangzhou Minder-Hightech Co.,Ltd.
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  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder
  • Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder

Multi-Chip Placement Packaging High-Precision Automatic Epoxy Die Bonder

Model: MDRB DB561

High-Precision Multi-Chip Placement Packaging Process

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Product Description

MDRB DB561 Automatic Epoxy Die Bonder

1. Supports simultaneous placement of multiple chip types; designed for high-precision multi-chip packaging processes.
2. Suitable for bonding substrates and chips via dispensing and die-bonding processes (COB/COC).
3. Features a linear motor structure and a high-precision CCD vision/alignment system to ensure placement accuracy.
4. Equipped with three independent pick-and-place heads to enable multi-chip die bonding.
5. Compatible with standard input formats: six 2-inch chip trays or three 6-inch wafers.
6. Configured with a substrate magazine loading system.
7. Includes a see-through (bottom-view) function for final alignment correction prior to placement.
8. Optional syringe dispensing and UV curing systems available.
9. Equipped with an auto-zoom lens to accommodate components of various sizes.
10. Programmable settings to meet diverse process requirements.
Equipment Specifications:
Equipment dimensions
X: 1470mm, Y: 1470mm, Z: 1880mm
Placement accuracy
±5µm
Angular accuracy
±0.2°
Die bonding force
10–50g
Wafer size
6-inch wafer expansion rings (3 units)
Tray
2-inch wafers (6 units)
Die size
0.2–4mm
Single dispensing time
1.2 seconds
Single die bonding time
4 seconds (depending on process conditions)
Tray loading/unloading time
10 seconds
Units per hour (UPH)
Approx. 500 units (depending on process conditions)
Method of material supply
Die bonding method
Die bonding with adhesive dipping; multi-chip placement
Substrate feeding method
Automatic magazine loading; dual-magazine station
Die feeding method
6-inch wafers; 2-inch trays
Adhesive supply
Adhesive trays; adhesive cartridges
Robotic Die-Bonding System:
The robotic arm utilizes a granite base for the X-axis, employing a linear motor and a 0.5 μm optical scale to form a fully closed-loop motion system; the Y-axis uses a high-precision ball screw and guide rail, achieving a repeatability of within ±1 μm. The pick-up nozzle on the robotic arm is made of Bakelite to prevent damage to the chips, with a controllable bonding pressure range of 10 g to 50 g.
Component Pickup and Placement:
1. Capable of independent chip pickup using three nozzles, with built-in rotational compensation for each nozzle.
2. Nozzles feature a cushioning function and mechanical pressure control, with a pressure range of 10–50 grams.
3. Utilizes a nozzle airflow monitoring system to detect the presence or absence of chips.
4. Nozzles support a see-through (transparent) capability.
Chip/Wafer (Tray) Assembly:
1. Wafer travel range: X: 470mm / Y: 210mm.
2. Compatible with clamping mechanisms for three 6-inch wafer rings and six 2-inch chip trays; includes ejector pin assembly and XY stage.
3. The ejector pin structure supports chip separation via either the film-pulling method (pins remain stationary while the blue film is pulled down) or the push-up method (blue film remains stationary while the pins push pward).
Chip Calibration Station:
1. Motor-compensated positioning: Uses a GMT 3-axis motion system (XYθ) to calibrate the chip's top side;
2. Vision-based positioning: Identifies features on the chip's underside and performs alignment via nozzle rotation;
3. Pressure calibration system.
Base X and Y Work Platforms:
A fully closed-loop motion system is constructed using linear motors and 0.5 μm linear scales, achieving a repeatability of within ±2 μm.
CCD Vision System:
1. Autofocus
2. Automatic zoom (0.6x–7x) Uses a Hikvision 5-megapixel camera for product identification and positioning, enhancing packaging precision. A total of four vision assemblies are employed; each assembly comprises an industrial camera, a lens, multiple LED light sources (spot, ring, and
side lighting), and adjustable light intensity (software-controlled with parameter saving).
3. Uses a high-definition fixed-magnification lens to inspect chip surface features, providing further compensation to ensure placement accuracy.
Dispensing System:
1. Equipped with three independent dispensing heads.
2. Utilizes a rotating adhesive disc; a flat blade scrapes the adhesive to maintain a consistent dispensing volume, which is controlled by adjusting the scraping thickness.
3. Compatible with syringe-based dispensing systems.
Packing & Delivery
Company Profile
Since 2014,Minder-Hightech is sales and service representative in Semiconductor and Electronic product industry equipment. We are committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. Until today, our brand's products have spread to major industrialized countries around the world, helping customers improve efficiency, reduce costs, and improve product quality.
FAQ
1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment:
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:
All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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