Félvezető termoelektromos hűtő TEC 15 μm puha érintéses pick-and-place gép, Kína félvezető termoelektromos hűtő TEC 15 μm puha érintéses pick-and-place gép gyártói, beszállítói, gyára

High-precision (15μm) Soft-touch Low-impact

Placement Machine

Functional Overview:

This high-precision die bonder is specifically designed for semiconductor thermoelectric coolers (TEC)

It is a high-precision, "soft-vibration" (gentle-vibration) die bonder, composed of several modular sub-units

1. A custom, direct-drive 3-axis bonding head with 360° nozzle rotation.

2. A worktable controlled by linear motors.

3. A 1.3-megapixel vision system for precise positioning.

4. A bonding stage equipped with a high-precision linear motor.

5. An automated carrier loading and unloading system.

6. A bulk material feeding system utilizing a "soft-vibration" (gentle-vibration) bowl feeder.

7. A downward-looking CCD camera for angular correction of the chip held by the nozzle.

8. A customized, high-speed 3-axis bonding head assembly.

External dimensions of the equipment (combination of two individual units):

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Equipment Structure Overview (Configuration of 2 individual units)

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Workflow (Configuration of 2 standalone units)

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Equipment Layout:

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Introduction to a custom 3-axis bonding head workstation:

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The three-axis bonding head is driven by high-precision linear motors.

The linear motor stators are fixed in place, resulting in a compact design with low load.

Voice Coil Motor (VCM)

The voice coil motor is primarily used to control the pressure applied by the nozzle.

Pressure adjustment range: 30g to 300g.

Rotary Motor

The rotary motor is primarily used to control the rotation of the nozzle (360°).

It utilizes a high-precision motor control system.

Technical Specifications (Configuration of 2 individual units)

UPH	14K (for chips/components)
X, Y placement positional accuracy	±15um
Placement angular accuracy	±1°
Placement force range and accuracy	30~300g ±10%
Particle/component feeding	Bulk component feeding via gentle vibration
Maximum camera resolution/accuracy	1.2um
Camera field of view (FOV)	4.0mm~25mm
Number of placement nozzles	4PCS
Number of soft-touch/low-impact units	2PCS
Materials to be placed	Semiconductor thermoelectric cooler (TEC) components
Placement stage size range	Width:77mm；Length:75mm
Worktable height	900mm±30mm
Power supply	AC 220V/50Hz
Power consumption	1200 W
Compressed air	4~6 Bar
External dimensions (W×D×H) (excluding loading/unloading units)	210010351900mm
Net weight	1800 Kg

Equipment Performance Features:

1.High speed: Optimized to meet the fastest industry standards based on specific customer process requirements.

2.High precision: Achieves industry-leading precision (for photolithography plates + chips) tailored to customer process requirements.

3.Angular accuracy: ±1°

4.Adjustable bonding force: 30g to 300g

5.Linear bonding head (with 360° rotating nozzle)

6.Versatile vision-based alignment options (outline, feature points, edge detection, and circle detection)

7.CPK quality monitoring and tracking

8.In-line configuration, allowing multiple units to be linked for complete device packaging

9.Soft-vibration feeding system

10.Multi-nozzle design

11.Customizable to specific requirements (e.g., the soft-vibration feeder can be replaced with a UV-tape feeding system)

Application of various vision algorithms:

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Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.

Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.

Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.

Please contact our engineers for detailed information regarding specific equipment.