High Speed and Precision Dispenser

MDZW-DJ2032 High Speed and Precision Dispenser

Product Overview:

1. Targeted solutions for micro-assembly of complex multi-chip structures and multi-material packaging.

2. "Graphical" display and guided programming, guided CAD compatibility, and efficient user product import.

3. "Database" mode process parameter interaction, high adaptability to multi-chip processes.

4. Combination of "standardized" and "customized" adhesive dispensing patterns, ensuring efficient product import and compatibility with demanding packaging requirements.

5. High precision, high speed, and high responsiveness combined, significantly reducing the difficulty of product process implementation.

6. Compatibility with existing placement equipment platforms, control systems, and data formats.

Product Features:

1. Optical imaging system including RGB adapts to various materials such as IC, FR4, HTCC, and LTCC.

2. Multiple Ref references combined with automatic height detection and updating adapt to complex devices.

3. Standard library covers over 95% of products, with "customization" covering special needs.

4. Multi-variety, fast product switching facilitates convenient capacity matching for extreme process requirements.

5. High-speed direct-drive common platform technology ensures stability, accuracy, and speed.

6. Self-developed high-response dispensing system reduces the impact of objective dispensing conditions.

7. Real-time data recording for traceability.

8. Dispensing volume monitoring technology (±0.25g) reduces quality risks.

9. Process-level comprehensive positioning accuracy: ±3um@30σ

10. Flexible height detection ensures dispensing conditions: ±3um@3σ (dependent on surface roughness)

11. High-response real-time compensation for dispensing, eliminating parameter sensitivity.

12. Dispensing condition correction ensures immediate consistency.

13. Graphical guided programming for rapid product introduction.

14. Guided CAD compatibility for rapid design import.

15. Database-based process parameter interaction for high adaptability to complex packaging.

16. Program, subprogram, and parameter library series product data compatibility.

Product Specifications:

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.