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  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine
  • High Precision Die Attach Machine

High Precision Die Attach Machine

Model: MDDB-QH12-25-3 / MDDB-QH12-15-05

Description:

  1. LF station
  2. magazine upload
  3. magazine exchange without stop
  4. magazine contain quantity: 3pcs
  5. LF dispensing station: Optional ring dispenser and stamping dispensing

 

Swing arm die picking up station1:

  1. Rotary use high torch 2000w servo motor control, 180degree swing, can adjust sucker pressure
  2. die placement accuracy:<±25um>
  3. die placement angle accurcy:<±3o >
  4. die missing check.

 

Wafer atation1:

with 12inch wafer station acceptable 8inch

wafer auto-expanding function

CCD system check and position wafer

automatic adjust the wafer anlge.

 

Correcting station:

  1. use linear motor and high precision grating to insure the accuracy.
  2. rotary use 5 phase motor control

 

Linear die picking up station 2:

  1. linear method pick and place die, pressure adjustable;
  2. die placement accuracy:<±15um~±25um>;
  3. die angle accuracy:<±1o >;
  4. die missing check.

 

Receipt:

  1. stackable magazine reception
  2. non-stopping when reception.

 

Basic function

  1. system: Windows 7
  2. interfaceChinese & English
  3. cycle time720ms(Max)   UPH5K
  4. whole position accuracy:±15um~±25um
  5. whole angle position:±1°
  6. die size1mm*1mm10mm*10mm
  7. LF sizelength260mm  width80mm
  8. power220V±10V50HZ  700W
  9. airpressure):56Kgf/cm 2

 

Function:

  1. die missing checking function
  2. no limit program number stortage
  3. external UPS system
  4. internal vacuum pump
  5. with Mapping function
  6. die bonding quality check
  7. reverse check function
  8. size LWH:2200mm*1400mm*1600mm ()
  9. Weight: 1500Kg

 

Die picking up station

  1. pick up toolsurface picking up
  2. swing arm180°rotoray
  3. picking up pressure20g200g

 

Die bonding station

  1. headrotarysurface mounter
  2. die attach sidelinear moving
  3. die attach pressure20g200g
  4. wafer stationmax stroke:12” × 12” (325 mm × 325mm)
  5. repeat accuracy:±2um
  6. ejector stroke: 3mm (Max)

 

Linear die bonding systemrepeat accuracy:±2um

 

Dispensing system:

  1. dual dispensing system
  2. upload and download system
  3. magazine
  4. max lead frame size80 mm ×260mm

Inquiry

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