Description:
- LF station
- magazine upload;
- magazine exchange without stop;
- magazine contain quantity: 3pcs;
- LF dispensing station: Optional ring dispenser and stamping dispensing;
Swing arm die picking up station1:
- Rotary use high torch 2000w servo motor control, 180degree swing, can adjust sucker pressure
- die placement accuracy:<±25um>;
- die placement angle accurcy:<±3o >;
- die missing check.
Wafer atation1:
with 12inch wafer station acceptable 8inch;
wafer auto-expanding function;
CCD system check and position wafer;
automatic adjust the wafer anlge.。
Correcting station:
- use linear motor and high precision grating to insure the accuracy.
- rotary use 5 phase motor control
Linear die picking up station 2:
- linear method pick and place die, pressure adjustable;
- die placement accuracy:<±15um~±25um>;
- die angle accuracy:<±1o >;
- die missing check.
Receipt:
- stackable magazine reception;
- non-stopping when reception.
Basic function:
- system: Windows 7
- interface:Chinese & English
- cycle time:720ms(Max) UPH≥5K
- whole position accuracy:±15um~±25um
- whole angle position:±1°
- die size:1mm*1mm~10mm*10mm
- LF size:length≤260mm width≤80mm
- power:220V±10V,50HZ 700W
- air(pressure):5~6Kgf/cm 2
Function:
- die missing checking function
- no limit program number stortage
- external UPS system
- internal vacuum pump
- with Mapping function
- die bonding quality check
- reverse check function
- size LWH:2200mm*1400mm*1600mm ()
- Weight: 1500Kg
Die picking up station:
- pick up tool:surface picking up
- swing arm:180°rotoray
- picking up pressure:20g~200g
Die bonding station:
- head:rotary,surface mounter
- die attach side:linear moving
- die attach pressure:20g~200g
- wafer station:max stroke:12” × 12” (325 mm × 325mm)
- repeat accuracy:±2um
- ejector stroke: 3mm (Max)
Linear die bonding system:repeat accuracy:±2um
Dispensing system:
- dual dispensing system
- upload and download system
- magazine
- max lead frame size:80 mm ×260mm