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  • Flip Chip Die Bonder
  • Flip Chip Die Bonder

Flip Chip Die Bonder

Model: MDAX-FC810

This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips.

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This model is a fixed crystal mount machine designed specifically for high-precision optical modules, optical devices, sensors, and various high-precision IC packaging flip chips.

 

AX-TL10 fully automatic high-speed solidification machine, composed of multiple sub unit modules:

  1. Linear fixed crystal chip bonding head+flip servo direct connection bonding head;
  2. Multi ejector pin design for easy adaptation to different types of wafer sizes;
  3. 1.3 million resolution visual system for chips and frameworks;
  4. Servo direct connected high-precision adhesive coating system;
  5. Material box feeding and receiving (customizable online mode);
  6. Solid crystal workbench module, using linear motor and high-precision grating ruler;
  7. Calibrate the module and perform X, Y θ correction.

Equipment Performance Characteristics:

  1. High speed: According to customer process requirements, achieve the fastest speed in the industry;
  2. Placement accuracy: According to customer process requirements, achieve the highest accuracy in the industry (lithography board+chip); Patch angle accuracy: ± 0.5 °;
  3. Low pressure monitoring: adjustable from 30g to 200g, with controllable error; Multiple structural configurations of Bangtou;
  4. Multiple image positioning schemes (appearance, feature points, edge finding, circle finding); Control and detection of the diameter of the first adhesive point
  5. Connection mode device, multiple serial devices complete device packaging.

Technical Specifications:

UPH

0.5-3K PCS（Chip related）

X. Y chip position accuracy

± 10um

Chip angle accuracy

± 1°

Patch pressure range and accuracy

30~200g ±10%

Ring size and adaptability

8 inch 、6inch 、Gel-PAK 、Wafer-PAK

Camera maximum accuracy

1um

Camera field of view

1.0mm~8mm

Number of suction nozzles

2PCS

Lower visual inspection

5 megapixel high-definition camera, image recognition

Number of thimbles

1PCS, multiple thimbles (optional)

Attachment materials

PD &PD Array, LD&LD Array, Driver , TIA, COC devise, TEC , Wedge , PLC chip, Sub mount ,Resistance, Capacitance, etc.

Vehicle size range

Width:40mm~80mm

Length:120mm~170mm

Console height

950mm ±30mm

Connection method of upstream and downstream equipment

SMEMA

Power supply

AC 220V/50Hz

Consumption

800 W

Compressed gas

4~6 Bar

External dimensions (WXDXH) (excluding loading and unloading machines)

1530*1230*1900mm

Net weight

1400 Kg

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