Film to Film Die Sorter
Function:
Work table (Linear Module) |
340mm*340 mm (12inch max) |
Resolution |
0.5um |
Wafer table (Linear Module) |
12"max |
Resolution |
1μm |
Rotary wafer table |
optional |
Wafer placement accuracy | |
Adhesive die position |
±25μm |
Rotation accuracy |
±0.5 |
Dispensing module |
optional stamp method for bonding usage |
Die pressure |
40-250g |
Arm rotary |
180 degree |
PR System | |
Method |
256 grey levels |
Detection |
ink / chipping / cracked die |
Monitor |
17"LCD |
Monitor Resolution |
1024*768 |
Optics System |
Camera |
Optics Magnifier (wafer) |
0.7 times to 4.5 times optional bigger one |
Cycle Time |
200MS/EA |
Die bonding cycle is less than 250 milliseconds. production capacity is greater than 12k; | |
Loading and unloading module |
Manual upload and download optional magazine upload and download |
Equipment Require | |
Voltage |
AC220V150HZ |
Air Source |
minimum 6BAR |
Vacuum Source |
700mm HG (Vacuum pump) |
Power Consumpion |
3000w |
Dimensions And Weight | |
Weight |
1000kg |
Size(D W H) |
1700*1400*1700mm |
Missing Die |
yes |
Vacuum Sensor |
|
Guangzhou Minder-Hightech Co.,Ltd.
Copyright © Guangzhou Minder-Hightech Co.,Ltd. All Rights Reserved
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