Dual Head High Speed Die Bonder , China Dual Head High Speed Die Bonder Manufacturers, Suppliers, Factory

Dual head high speed Die Bonder

Applicable to SMD2020 1010 2121 2835 5730, filament, etc

Model characteristics

1. Independent double head die bonding, double stamp arm, double wafer search design, stable and reliable；
2. 90 degree direct connection high-precision servo Bonding head；
3. Adjustable constant temperature direct connection high-precision stamp head；
4. Linear motor wafer table and die bonding working table；
5. Vacuum die missing detection;
6. Automatic loading and unloading system is adopted to reduce refueling time；
7. Visual quality inspection system, such as glue quantity detection, anti dazzle detection, post die bonding detection, etc；
8. Simple visual operation interface simplifies the operation of automation equipment；

Specification

system function
production cycle：	≥40ms Speed depends on chip size and bracket size
Die placement accuracy：	±25um
Chip rotation：	±3°
Wafer stage
Chip size：	3.5mi1×3.5mi1-80milx80mil
Support specification：	L（L):120-200mm W（W):50-90mm
Chip maximum angle correction：	±180°(Optional）
Maximum chip ring size/Max. Die Ring Size：	6"
Maximum chip area size：	4.7"
Rerolution：	1μm
Height stroke of ejector：	3mm
Image recognition system
Gray scale：	256Grayscale
resolving power：	752×480pixel
Image recognition accuracy：	±0.025mil@50mil Observation range
Suction swinging arm system
Die bonding swing arm：	90 ° rotatable
Picking up pressure：	Adjustable 20g-250g
Die bonding work table
Travel range：	75mm*175mm
XY resolving resolution：	0.5μm
Leadframe support size
Support length：	120m~170mm(Customized if the length is less than 80~120mm of the support）
Support width：	40mm~75m(30~40mm lower than the width of the support, customized）
Required facilities
Voltage/frequency：	220V AC±5%/50HZ
compressed air：	0.5MPa (MIN)
Rated power：	950VA
Air consumption/Gas Consumption：	5L/min
Volume and weight
L x W x H：	135×90×175cm
weight：	1200kg

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

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Dual Head High Speed Die Bonder

Applicable to SMD2020 1010 2121 2835 5730, filament, etc