Model: MD-TL10
Applicable products: PD, LD, VCSEL, Micro TEC, Mini TEC
Mounting accuracy: 士10μm
MD-TL10 High Precision Die Bonder
Applicable products: PD, LD, VCSEL, Micro TEC, Mini TEC
Mounting accuracy: 士10μm
Features:
1. Segmented die picking and die bonding;
2. Secondary XY and angular correction performed at the transfer station to enhance positioning accuracy;
3. Compatible with both standard metal die rings and nested (mother-and-child) rings;
4. Dispensing method options include syringe-based dispensing or dip-pin dispensing.
Parameters:
Technical Specifications |
Parameter Specifications |
UPH |
5,000 PCS (Max) |
X/Y Placement Accuracy |
±10 µm |
Placement Angle Accuracy |
±1° (Standard models can achieve ±0.5°) |
Placement Pressure Range & Accuracy |
50–500 g |
Wafer Ring Size & Compatibility |
12 inches (Max) |
Maximum Camera Accuracy |
1.2 µm |
Camera Field of View |
1.0 mm – 10 mm |
Dispensing System |
Dip dispensing or valve dispensing |
Number of Nozzles |
1 PCS |
Number of Ejector Pins |
1 PCS |
Placement Materials |
PD, LD, VCSEL, Micro/Mini TEC, etc. |
Carrier Size Range |
Width: 60 mm – 76 mm; Length: 110 mm – 170 mm |
Upstream/Downstream Equipment Interface |
SMEMA |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
950 W |
Compressed Air |
4–6 bar |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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