Model: MD-0063
Product: Mic TEC / Min TEC chip
Accuracy: ± 10 μm
Micro TEC / Mini TEC Thermoelectric Coolers Die Bonder
Product: Mic/Min TEC chip
Accuracy: ± 10 μ m
Features:
1. Custom-designed linear 3-axis die-bonding head with 360° nozzle rotation;
2. High-precision flip-type pickup claw, paired with a mature, specialized PR algorithm for SMD components, ensuring highly accurate placement;
3. High-subdivision DD motor for precise control of deflection angles;
4. 4K HD CCD camera and FA lens for real-time monitoring, simultaneously facilitating convenient debugging.
Parameters:
Technical Specifications |
Parameter Specifications |
UPH |
2K PCS (Material-dependent) |
X/Y Placement Accuracy |
±10 µm |
Placement Angle Accuracy |
±0.1° |
Placement Pressure Range & Accuracy |
20–300 g ±10% |
Loading/Unloading Method |
Material Cassette |
Maximum Camera Accuracy |
1 µm (Integrated Vision Accuracy) |
Applicable Chip Size |
1.5 mm – 10 mm |
Camera Field of View |
5 mm – 25 mm |
Number of Nozzles |
1 PCS |
Flip Gripper |
1 PCS |
Placement Materials |
Miniature TEC Ceramic Chips or Flip-Chip Products |
Substrate Table Size Range |
Width: 77 mm; Length: 70 mm |
Operating Table Height |
950 mm ±30 mm |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
900 W |
Compressed Air |
4–6 bar |
Dimensions (W×D×H) |
1150 × 1240 × 1950 mm (Excluding Loader) |
Net Weight |
900 kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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