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  • Automatic Die Attach MDDB-QH12
  • Automatic Die Attach MDDB-QH12
  • Automatic Die Attach MDDB-QH12
  • Automatic Die Attach MDDB-QH12

Automatic Die Attach MDDB-QH12

Model: MDDB-QH12

MDDB-QH12 Die Attach Machine

微信图片_20231206143138.jpg

Function:

  1. Die missing checking function
  2. No limit program number storage
  3. External ups system
  4. Internal vacuum pump
  5. With mapping function
  6. Die bonding quality check
  7. Reverse check function

 

LF station:

  1. magazine upload
  2. magazine exchange without stop
  3. magazine contain quantity: 3pcs

 

LF dispensing station: optional ring dispenser and stamping dispensing.

 

Swing arm die picking up station 1:

  1. rotary use high torch 2000w servo motor control, 180degree swing,can adjust sucker pressure
  2. die placement accuracy:<±25um>
  3. die placement angle accurcy:<±3o >
  4. die missing check.

 

Wafer station 1:

  1. with 12inch wafer station acceptable 8inch
  2. wafer auto-expanding function
  3. CCD system check and position wafer
  4. automatic adjust the wafer angle.

 

Correcting station:

  1. use linear motor and high precision grating to insure the accuracy.
  2. rotary use 5 phase motor control

 

Linear die picking up station 2:

  1. linear method pick and place die, pressure adjustable;
  2. die placement accuracy:<±15um~±25um>;
  3. die angle accuracy:<±1o >;
  4. die missing check.

 

Receipt:

  1. stackable magazine receiption
  2. non-stoping when receition

Basic function

system

Windows 7

interface

Chinese & English

cycle time

720ms(Max)   UPH≥5K

whole position accuracy

±15um~±25um

whole angle position

±1°

die size

1mm*1mm10mm*10mm

LF size

length≤ 260mm  width≤80mm

power

220V±10V50HZ 700W

airpressure

56Kgf/cm 2

Size

2200mm*1400mm*1600mm

Weight

1500kg

die picking up station

 

pick up tool

surface picking up

swing arm

180°rotate

picking up pressure

20g200g

die bonding station

head

rotarysurface mounter

die attach side

linear moving

die attach pressure

20g200g

wafer station

max stroke

12” × 12” (325 mm × 325mm)

repeat accuracy

±2um

ejector stroke

3mm (Max)

linear die bonding system

repeat accuracy

±2um

dispensing system

dual dispensing system

max lead frame size

80 mm ×260mm

Equipment Real Shoot:

微信图片_20240416171401.jpg微信图片_20240416171413.jpg

FAQ

1. About Price:

All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:

We can provide sample production services for you, but you may provide some fees.

3. About Payment:

After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:

After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:

After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:

Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

7. After-sale Service:

All machines have a warranty period of over one year. Our technical engineers are always online to provide you with equipment installation, debugging, and maintenance services. We can provide on-site installation and debugging services for special and large equipment.

Inquiry

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