Submicron Multifunctional Die Bonder

The Multifunctional Sub-Micron Die Bonder is a high-performance system designed for micro-assembly and bonding processes in laboratory-scale process development. It supports a wide range of applications—including die-to-heatsink and die-to-wafer bonding, assembly of miniature components, laser diode bonding, high-end device and chip packaging, ultra-high-precision micro-assembly, photodiode assembly, laser bar bonding, and the debonding of specialized materials—serving as an essential tool for experimental research and development across various fields.

Applications:

Micro-component assembly, Debonding Process for Specialized Materials, Photodiode

Chip attachment, Packaging and bonding of high-end chips, Laser Bar Bonding,

Laser bonding, Various types of ultra-high-precision micro-assembly, Assembly of high-end devices.

Die-to-heat sink substrate bonding:

Die-to-wafer bonding

Core Advantages:

1. High-definition image resolution;
2. Cost-effective solutions and applications;
3. Highly efficient after-sales technical support.

Process:

1. Eutectic bonding via a pulsed-heating bottom platform;
2. Dispensing and dipping (UV-curable adhesives, thermosetting adhesives, silver paste, etc.);
3. Thermo compression bonding with temperature-profiled heating of the placement nozzle (for AuSn, solder preforms, etc.);
4. UV-curing (ultraviolet irradiation);
5. Ultrasonic bonding of flip-chip gold bumps.

Features:

1. Closed-loop visual positioning system with an accuracy of ±0.5 μm
2. Modular design and high-level system integration; specific modules can be added as needed to suit various complex processes and applications
3. Substrate placement modules and chip-pickup nozzles accommodate a range of sizes, eliminating the need for frequent component changes
4. High precision and exceptional stability are maintained consistently over long periods of operation
5. Real-time process monitoring and clear, intuitive visualization make operation extremely simple and convenient

Configuration Modules / Optional Application Modules

1. Optical system
2. Computer unit
3. UV irradiation instrument
4. XYZ fine-adjustment fixture
5. High-precision marble platform
6. Side-view camera assembly
7. Vibration-dampened workstation frame
8. Inert gas shielding system

1. Vacuum and pneumatic system
2. Pressure control instrumentation
3. Support for ultrasonic thermocompression bonding modules
4. Upper heating/nozzle assembly
5. Dispensing module controller
6. Side-mounted dispensing module
7. Constant-temperature controller
8. Pulse-heating controller

Technical Parameters:

Optional Configurations:

1. Conventional thermocompression bonding—requires modules such as: standard non-heated pickup nozzles, temperature-profile-controlled heating modules, and high-precision pressure modules.

2. Standard die bonding (without heating)—requires modules such as: standard non-heated pickup nozzles and high-precision pressure modules.

3. Epoxy-dispensing die bonding—requires modules such as: standard non-heated pickup nozzles, manual dispensing modules, and high-precision pressure modules.

4. Ultrasonic gold-ball bonding—requires modules such as: standard non-heated pickup nozzles, ultrasonic modules, and high-precision pressure modules.

5. Debonding-mode die bonding—requires modules such as: universal self-balancing pickup nozzles, temperature-profile-controlled heating modules, and high-precision pressure modules.