Model: MD-8601
Applicable product: TEC cooler particle patch
Bonding accuracy:+25μm
MD-8601 PE Thermoelectric Cooler TEC Die bonder
Applicable product: TEC cooler particle patch
Bonding accuracy:+25μm
Features：
1. Direct-drive die-bonding head with 180° swing-arm rotation;
2. Automatic adhesive-coating mechanism for ceramic substrates;
3. AOI inspection function for adhesive coating;
4. Dual-head configuration with two independent die-bonding arms, dedicated respectively to the pickup and bonding of P-type and N-type materials.
Parameters：
Technical Specifications |
Parameter Specifications |
UPH |
25–30K PCS (Chip-related) |
X/Y Placement Accuracy |
±25 µm |
Placement Angle Accuracy |
±3° |
Placement Pressure Range & Accuracy |
20–300 g ±10% |
Wafer Ring Size & Compatibility |
Compatible with 8-inch and 6-inch wafer trays |
Maximum Camera Accuracy |
1 µm |
Camera Field of View |
1.0 mm – 5 mm |
Number of Pick-up Nozzles |
4 PCS |
Number of Ejector Pins |
2 PCS; Multiple Ejector Pins (Optional) |
Placement Materials |
PN Junction Chips |
Carrier Size Range |
Width: 40 mm – 95 mm; Length: 120 mm – 200 mm |
Upstream/Downstream Equipment Interface |
SMEMA |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
1500 W |
Compressed Air |
4–6 bar |
Dimensions (W × D × H) |
2250 × 1700 × 1865 mm (Excluding Loader/Unloader) |
Net Weight |
1800 kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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