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  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine
  • ±25 μm Fully Automatic TEC Die Placement Machine

±25 μm Fully Automatic TEC Die Placement Machine

Model: MD -8600PE

Application Product: TEC cooler chip

Placement accuracy: ±25 μm

MD -8600PEFully Automatic TEC Die Placement Machine

Application Product: TEC cooler chip

Placement accuracy: ±25 μm

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Performance:

1. A fully automated machine integrating functions such as solder paste printing on cold and hot ceramic chips, AOI (Automated Optical Inspection), PN particle placement, and chip assembly.

2. Compatible with ceramic chips in various specifications (e.g., 20–50 series).

3. Equipped with a 4-head, 4-arm system for PN particle placement.

4. Supports 8-inch and 6-inch wafer rings.

5. Features multiple image-based positioning methods (based on outline, feature points, edge detection, or circle detection).

Parameters:

Technical Specifications

Specifications

UPH (Units Per Hour)

50–60K PCS (related to chips)

Placement Accuracy (X, Y)

±25 µm

Placement Angle Accuracy

±3°

Placement Force Range and Accuracy

20–300 g ±10%

Wafer Ring Size and Compatibility

8inch、6inch

Maximum Camera Precision

1 µm

Camera Field of View (FOV)

1.0 mm – 5 mm

Number of Nozzles

4 PCS

Number of Ejector Pins

4 PCS,multi-pin (optional)

Materials for Placement

PN particle chip

Carrier Size Range

Width: 40 mm – 95 mm; Length: 120 mm – 200 mm

Worktable Height

950 mm ±30 mm

Upstream/Downstream Equipment Connectivity

SMEMA

Power Supply

AC 220 V / 50 Hz

Power Consumption

1500 W

Compressed Air

4–6 bar

External Dimensions (W × D × H)

3280 × 1700 × 1865 mm

Net Weight

1800 kg

Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.

Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.

Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.

Please contact our engineers for detailed information regarding specific equipment.

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