Model: MD -8600PE
Application Product: TEC cooler chip
Placement accuracy: ±25 μm
MD -8600PEFully Automatic TEC Die Placement Machine
Application Product: TEC cooler chip
Placement accuracy: ±25 μm

Performance:
1. A fully automated machine integrating functions such as solder paste printing on cold and hot ceramic chips, AOI (Automated Optical Inspection), PN particle placement, and chip assembly.
2. Compatible with ceramic chips in various specifications (e.g., 20–50 series).
3. Equipped with a 4-head, 4-arm system for PN particle placement.
4. Supports 8-inch and 6-inch wafer rings.
5. Features multiple image-based positioning methods (based on outline, feature points, edge detection, or circle detection).
Parameters:
Technical Specifications |
Specifications |
UPH (Units Per Hour) |
50–60K PCS (related to chips) |
Placement Accuracy (X, Y) |
±25 µm |
Placement Angle Accuracy |
±3° |
Placement Force Range and Accuracy |
20–300 g ±10% |
Wafer Ring Size and Compatibility |
8inch、6inch |
Maximum Camera Precision |
1 µm |
Camera Field of View (FOV) |
1.0 mm – 5 mm |
Number of Nozzles |
4 PCS |
Number of Ejector Pins |
4 PCS,multi-pin (optional) |
Materials for Placement |
PN particle chip |
Carrier Size Range |
Width: 40 mm – 95 mm; Length: 120 mm – 200 mm |
Worktable Height |
950 mm ±30 mm |
Upstream/Downstream Equipment Connectivity |
SMEMA |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
1500 W |
Compressed Air |
4–6 bar |
External Dimensions (W × D × H) |
3280 × 1700 × 1865 mm |
Net Weight |
1800 kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
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