Model: MD-006PLUS
Applicable products: PD, LD, VCSEL, Micro TEC, Mini TEC
Mounting accuracy: ± 15 μ m
MD-006PLUS High precision and High-speed Micro TEC, Mini TEC Die Bonder
Applicable products: PD, LD, VCSEL, Micro TEC, Mini TEC
Mounting accuracy: ± 15 μ m
Features:
1. Custom linear 3-axis die-bonding head with 360° nozzle rotation;
2. Single placement head featuring a dual-nozzle pick-and-place mode to enhance efficiency;
3. Down-looking CCD camera ensures precise chip angular alignment;
4. Dual-option feeding mode: feeding of loose chips or chips mounted on blue/UV film.
Parameters:
Technical Specifications |
Parameter Specifications |
UPH |
8K (Chip-related) |
X/Y Placement Accuracy |
±15 µm |
Placement Angle Accuracy |
±1° |
Placement Pressure Range & Accuracy |
20–300 g ±10% |
Chip Feeding |
Bulk feeding via gentle vibration, or Blue/UV film |
Max. Camera Accuracy |
1 µm |
Camera Field of View |
4.0 mm – 25 mm |
Number of Nozzles |
2 pcs |
Number of Soft-Vibration Feeders or Wafer Rings |
1 pcs |
Placement Materials |
PD, LD, VCSEL, Micro/Mini TEC, etc. |
Placement Stage Dimensions |
Width: 80 mm; Length: 150 mm |
Power Supply |
AC 220 V / 50 Hz |
Power Consumption |
900 W |
Compressed Air |
4–6 bar |
Overall Dimensions (W×D×H) (Excluding Feeder) |
860 × 1035 × 1950 mm |
Net Weight |
700 kg |
Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.
Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.
Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.
Please contact our engineers for detailed information regarding specific equipment.
Guangzhou Minder-Hightech Co.,Ltd.
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