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Bidyo
- Minder-Hightech Company
- Wafer Fabrication
- IC/TO Pakete Video
- Hermetic Sealing Systems
- Plasma Cleaner
- Winding Machine
- Ultrasonic Welder
- Grinder At Polisher Video
- Mga Solusyon sa Laser
- Robot na Pang-dispensing, Soldering, at Screwing
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Presisyon ± 5um, anggulo ± 0.5um, MEMS, sensor, mataas na presisyon Die bonding machine Die sorter
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Ekipmento sa laboratoryo para sa chip packaging: Oven, Tratamentong Plasma sa ibabaw, Wire bonder, Die bonder
