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Home> TEC Specific Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder
  • +38 μm Thermoelectric Coolers TEC Die Bonder

+38 μm Thermoelectric Coolers TEC Die Bonder

Model: MD-580

Applicable products: Suitable for ceramic tiles with specifications ranging from 20 to 50

Accuracy:+38 μ m

MD-580 Assembly Machine for Thermoelectric Coolers (TEC)  

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Applicable products: Suitable for ceramic tiles with specifications ranging from 20 to 50

Accuracy:+38 μ m

Features:

1. Applicable to the lamination of ceramic chips ranging from Size 20 to Size 50;

2. Key functions include chip loading and printing, dual-channel 3D inspection, flip-and-stack lamination, loading onto positioning fixtures, and defective product collection;

3. Throughput: 100 fixtures (each fixture accommodates 4 to 12 ceramic chips);

4. Positioning Accuracy: ±25 µm to ±38 µm (excluding chip-specific tolerances);

5. Frame Dimensions: Length ≤ 130 mm, Width ≤ 90 mm;

6. Vision System: High-precision, adjustable image recognition and positioning system.

Parameters:

Technical Specifications

Parameter Specifications

Hourly Throughput

80–100pcs Fixtures

Positioning Accuracy

±38 µm

Solder Paste Volume

<±15%

Solder Paste Inspection Accuracy

<±3 million

3D Inspection Imaging

Detects missing, tilted, misaligned, or damaged NP particles, etc.

Panel Size Range

Width: 89 mm; Length: 127 mm

Upstream/Downstream Equipment Interface

SMEMA

Power Supply

AC 220 V / 50 Hz

Power Consumption

1000 W

Compressed Air

5–6 bar

Dimensions (W × D × H)

2030 × 1700 × 1650 mm (Excluding Loader)

Net Weight

1300 kg

Minder-Hightech provides professional, one-stop customized equipment solutions for TEC (Thermoelectric Cooler) packaging facilities.

Our offerings include Die Bonders, Wire Bonders, Hermetic Packaging Equipment, Plasma Surface Treatment Systems, and more.

Our engineering team brings 16 years of experience in chip packaging. We offer specialized technical expertise, competitive pricing, and comprehensive after-sales support.

Please contact our engineers for detailed information regarding specific equipment.

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