Semi-automatic and Manual Advanced Wire Bonder , China Semi-automatic and Manual Advanced Wire Bonder Manufacturers, Suppliers, Factory

Product Description

Semi-automatic and Manual Advanced Wire Bonder

MDZW-WB1875:Wedge-wedge Manual & semi-automatic
MDZW-BB1850:Ball-wedge Manual & semi-automatic
MDZW-BW1880:Ball-wedge & wedge-wedge Manual & semi-automatic

Feature

1. Fixed arc height, fixed line length, automatic arc starting, improve line arc consistency
2. Real-time monitoring of solder joint deformation, effectively guaranteeing the quality of bonding solder joints
3. Manual/semi-automatic function online switching, flexible and convenient, better product compatibility
4. Ball planting wireless tail/BSOB/BBOS/adding ball position/pad ball position can be set online, automatic point alignment
5. Ball welding and wedge welding are integrated, convenient and fast switching

Advantages

1. Manual and automatic, with the flexibility of manual machine and the consistency of semi-automatic machine
2. Ball and wedge integrated, easy to switch
3. Based on full closed-loop grating feedback, Z-axis motion accuracy is 1um, more accurate and stable
4. Based on DSP digital phase-locked technology, the transducer vibrates more evenly and stably
5. Real-time monitoring of solder joint deformation, quality assurance, high consistency
6. Wire arrangement function, manually complete the first wire, automatically complete the rest of the wire bonding, high
efficiency

Specification

XYZ axis	travel 15mm15mm18mm
Wire diameter	Gold wire 18-75um；Platinum wire 18-25um；Aluminum wire 18-80mm；Gold belt 2512.7μm-30025.4μm
Cavity depth	compatible with 16/19mm ball welding splitter 16/19/25/32mm wedge welding splitter；Cavity depth up to 21mm
Bonding pressure	5-150g, accuracy 0.1g, online programmable
Ultrasonic power	0-5W, 1000 times subdivision
Device size	compatible with more than 200mm
Spool size	compatible with both 1/2-inch and 2-inch spools
Overall dimensions	750mm W580mm D500mm H
Weight	80KG
Power supply	AC220V±10%@50HZ, 10A, less than 500W
Compressed air	>0.2MPa, purified air source
Lifting platform size	250mm250mm18mm

Packing & Delivery

Company Profile

Minder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014，the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment.

FAQ

1. About Price:
All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.

2. About Sample:
We can provide sample production services for you, but you may provide some fees.

3. About Payment：
After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.

4. About Delivery:
After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.

5. Installation and Debugging:
After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.

6. About Warranty:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.

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Semi-automatic and Manual Advanced Wire Bonder

Semi-automatic and Manual Advanced Wire Bonder

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